AMD, IBM Confirm Extension Process Technology Research Pact

AMD, IBM to Co-Develop 32nm, 22nm Fabrication Processes

by Anton Shilov
10/31/2005 | 11:40 PM

As expected, Advanced Micro Devices and IBM announced they had broadened the scope of their technology alliance and the pact now includes early exploratory research of new transistor, interconnect, lithography, and die-to-package connection technologies through 2011. Particularly, the companies are set to help each other developing 32nm and 22nm process technologies.

 

“By expanding our successful IBM alliance, we can significantly increase our level of early-stage research, focusing on technologies for the 32nm and 22nm technology generations. By influencing and participating in this research, AMD can better align its process technologies with the needs of our products scheduled to be introduced late in this decade and beyond,” said Craig Sander, corporate vice president of technology development at AMD.

The agreement marks the first time a member of a technology development alliance will work directly with IBM’s Research Division on R&D, electronic materials, and basic feasibility studies three-to-five years before commercialization. Further, the extended duration of the alliance makes it one of the longest IBM currently has with any of its semiconductor alliance associates.

Early exploratory research is a critical component of microprocessor R&D. This collaboration will enable both companies to identify and investigate future technology challenges earlier, allowing solutions to be found and fundamental technology choices to be made sooner.

Research and development will take place in IBM’s Watson Research Center in Yorktown Heights, N.Y., the newly announced center for semiconductor research at Albany NanoTech, and at IBM’s 300 millimeter state-of-the-art manufacturing facility in East Fishkill.