by Anton Shilov
04/01/2010 | 02:46 PM
Globalfoundries, a contract maker of semiconductors controlled by Advanced Micro Devices and Advanced Technology Investment Company, said on Thursday that it had cancelled its 32nm bulk fabrication process technology with high-k metal gate (HKMG). The company became the second foundry to scrap 32nm bulk process tech and proceed directly to 28nm HKMG manufacturing technology.
“All of our efforts around next-gen graphics and wireless are focused on 28nm with HKMG and we no longer have a 32nm bulk process. We removed this off our roadmap due to lack of customer demand as most are making the jump from 40/45nm right to 28nm,” said Jon Carvill, the head of public relations at Globalfoundries.
Earlier Taiwan Semiconductor Manufacturing Company, the world’s largest contract manufacturer of semiconductor, decided to scrap plans for its 32nm bulk process technology, which caused several companies to reconsider their own roadmaps. TSMC’s 32nm bulk fabrication process did not feature HKMG and was largely considered as shrink of the company’s 40nm fabrication process.
For the 28nm generation, which will be offered on bulk silicon substrates, the company will be accepting customer and third party IP designs in Q1 2010 on its shuttle service for low cost prototyping, with production planned in the second half of 2010. The 28nm technology offers the smallest SRAM cell size (0.120µm²) currently reported in the foundry industry, and an advantage in die size relative to 28nm “Gate Last” approaches. In addition, the Globalfoundries’ “Gate First” approach to HKMG simplifies 28nm design implementation and IP re-use for customers using conventional poly/SiON-based technology at the 45/40nm and 32nm nodes due to similar process flows and design rules.
Customers at the 28nm node will benefit from a high-volume ramp of leading-edge technology at the 32nm node. The 28nm node will be available in two variants: