TSMC to Cooperate with SEMATECH on 20nm Process Technologies and Beyond

TSMC Joins SEMATECH as Core Member to Develop Sub-20nm Process Technologies

by Anton Shilov
05/16/2011 | 10:19 PM

Taiwan Semiconductor Manufacturing Company and SEMATECH, the international consortium of semiconductor manufacturers, have announced TSMC’s decision to join SEMATECH as a core member. The cooperation will focus on advanced technology development to address some of the industry’s most pressing challenges.

 

TSMC will join SEMATECH to collaborate on semiconductor research and development for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450mm wafer size.

SEMATECH's strong relationships with suppliers, chip makers, universities, and research institutes around the world are a critical element in providing cutting-edge research and development to its members. SEMATECH’s other core members include GlobalFoundries, HP, IBM, Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE).

“This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers. This complementary cooperation leverages SEMATECH’s collaborative approach to lead critical industry technology transitions, with TSMC’s position as an industry leader in advanced technology development and manufacturing," said Jack Sun, vice president and chief technology officer of research and development at TSMC.

SEMATECH manages an international network of collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies, and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.