Intel to Highlight Mobile, Multi-Core Chips, Exascale Computing at IDF

Intel to Reveal New Technologies and Breakthroughs at IDF

by Anton Shilov
08/24/2011 | 09:06 PM

At the forthcoming three-day Intel Developer Forum, the world's largest maker of chips will reveal a number of new technologies and breakthrough innovations. The company plans to highlight its future multi-core and many-core chips as well as look ahead into the future of mobile and supercomputing.


At the annual IDF show, which will take place on September 12-15, 2011, is Moscone Center West, San Francisco, California, Intel's executives will share the stage with other technology leaders and visionaries. From subjects including security, cloud computing and ultrabooks, IDF will focus on Intel’s directions for the next year and beyond.

Paul Otellini, president and chief executive officer of Intel. will kick off IDF with a look ahead and his vision of the evolution of computing.

Mooly Eden, corporate vice president and general manager of the PC client group, will dive deeper on near-future Intel products and technologies, including the new ultrabook category.

Justin Rattner, vice president and Intel's chief technology officer, will reveal the latest advances in multi-core and many-core computer chips. Mr. Rattner will also unveil up-to-date research and technology breakthroughs such as extreme-scale computing, contextual awareness, and near-threshold circuit topologies that dramatically reduce energy consumption.

More than 180 leading companies from around the world will have hands-on demonstrations of their newest innovations and future technologies at the IDF technology showcase.