by Anton Shilov
10/10/2011 | 09:42 PM
ARM and United Microelectronics Corp., a leading global semiconductor foundry, have announced a long-term agreement that provides UMC foundry customers with access to the latest advanced ARM Artisan physical IP solutions validated on UMC's 28HPM process technology. This will allow yet-to-be-disclosed UMC customers to make ARM-based system-on-chip (SoC) devices using the latest process tech.
The ultra-low leakage high-K metal gate device structure that enables UMC's gate-last 28HPM process technology offers many options for device voltages, memory bit-cells, underdrive, and overdrive capabilities to help SoC designers realize both high performance and extended battery life.
This latest 28nm process technology targets a wide range of applications that includes portable devices, such as mobile and wireless, and high performance applications, such as digital home and high-speed networking. Harnessing the strengths of both companies, this collaboration will deliver superior technology and support to mutual customers.
"We are pleased that UMC has selected ARM Artisan Physical IP for its 28HPM process. Mutual customers will now have access to a complete solution of advanced physical IP that is highly suited for implementing ARM technology , such as the ARM CortexTM-A processor series," said Simon Segars, executive vice president and general manager of physical IP division at ARM.
UMC's 28HPM process technology is scheduled for pilot production in mid-2012. It is unclear when actual 28nm chips are produced for revenue. It is expected that the deeper collaboration of ARM and UMC in the development of process technology and advanced physical IP at 28nm nodes will result in optimized performance, energy efficiency and chip density.
"We are delighted to expand our long-standing relationship with ARM, which spans over 10 years. This UMC-sponsored development will provide customers with access to the most comprehensive ARM physical IP solutions on UMC's versatile and robust process technologies. This will enable faster time-to-market for critical market segments. The cooperation further demonstrates our commitment to deliver industry leading resources for customers designing into UMC's most advanced 28nm process node," said S. C. Chien, vice president of customer engineering & IP development design support divisions at UMC.