Globalfoundries: Plans for 14nm Process Technology Are Underway

Globalfoundries Continues to Praise Gate-First HKMG Process Technology

by Anton Shilov
01/27/2012 | 10:10 PM

Globalfoundries, a leading contract maker of semiconductors controlled by ATIC and AMD, said that it had began planning 14nm process technology and that it would continue to upgrade its existing fab in Dresden, Germany, so that it could continue to produce leading-edge chips, including microprocessors and accelerated processing units for Advanced Micro Devices.


Ajit Manocha, chief executive officer of Globalfoundries, said in an interview with EETimes web-site that the company would continue to develop its Dresden facility and that the fab would make chips using the latest manufacturing processes, including 32nm, 28nm, 20nm and even 14nm. The planning and researching of 14nm fabrication technology has already started, according to the executive.

This is the first time when Globalfoundries started to talk about 14nm fabrication process in general. Previously, the company only talked about 16nm process technology and a plan to use EUV lithography for such nodes.

The head of Globalfoundries also noted that the company had already shipped over 700 thousand wafers processed using high-K metal gate (HKMG) 32nm manufacturing technology, whereas Taiwan Semiconductor Manufacturing Company only managed to sell “a few thousand wafers” processed utilizing gate-last 28nm HKMG tech. TSMC admits that the majority of chips it made using 28nm fabrication process rely on silicon oxynitride and not on a high-k metal gate. Nonetheless, it should be noted that Globalfoundries had to overcome dramatic challenges with ramping up its 32nm SOI HKMG technology.

“People thought that gate first would never work, but didn’t we prove everybody wrong?” asked Mr. Manocha.