by Anton Shilov
02/08/2012 | 11:24 PM
The so-called IBM fab club - Globalfoundries, IBM and Samsung Electronics - plan to preview the future of chip production technology at the 2012 Common Platform technology forum to be held at the Santa Clara, California, on March 14, 2012.
The companies will address next-generation semiconductor innovation and discuss the Common Platform’s technology - covering critical topics such as 28nm, 20nm and 14nm processes, as well as innovations beyond 14nm and 450mm wafer manufacturing.
"The Common Platform alliance is built upon an legacy of invention and deep commitment to research and development from IBM. The combined expertise of the companies involved is driving truly breakthrough technology innovations for semiconductor manufacturing. Our focus on building the most extensive and open ecosystem around our core manufacturing capabilities delivers customers a flexible and risk-free way to bring a wide range of semiconductor products to market," said Michael Cadigan, general manager of IBM Microelectronics, on behalf of the common platform alliance.
The Common Platform technology forum will include keynotes from industry leaders and presentations from senior members of the Common Platform partners’ management and technical teams. A key part of the forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, packaging and design services companies.