USB Promo Group Re-Emphasizes Plan to Finalize USB 3.0/100W Spec This Quarter

USB Promoters on Track with Extension of USB 3.0 Capabilities

by Anton Shilov
04/10/2012 | 10:22 PM

The USB 3.0 Promoter Group has announced that the USB power delivery specification and SuperSpeed USB inter-chip (SSIC) specification are both on track for completion by the end of Q2 2012. Both new technologies will substantially extend capabilities of universal serial bus technology and will thus extend its potential reach.


The USB power delivery specification will enable increased power delivery via USB cables and connectors, expanding cable bus power capabilities in USB applications. The specification enables higher voltage and current to deliver power up to 100W. It also enables a switchable source of power delivery without changing cable direction. The specification is compatible with existing cables and connectors and will coexist with the USB battery charging 1.2 specification and existing USB bus-powered applications.

The SSIC specification will define a chip-to-chip USB based interconnect optimized for mobile device internal use. The specification will bring the MIPI Alliance’s M-PHY high bandwidth and low power capabilities combined with the performance enhancements of SuperSpeed USB.

"The USB 3.0 promoter group continues to develop practical specifications to support more platform types and new use cases, which benefit from SuperSpeed USB. The industry reviews for the USB Power Delivery and SSIC specifications have proven successful, and it is exciting to see these specifications come to fruition," said Brad Saunders, chairman of USB 3.0 promoter group.

Both specifications are currently at a 0.9 draft completion level, essentially the equivalent of final specifications that implementers can use to start developing products. Prototyping activities to help validate the major technical elements of each specification are well underway and will be completed prior to the final release of these specifications.

The USB Power Delivery and SuperSpeed USB inter-chip specifications will be discussed during a USB session at the Intel Developer Forum (IDF) being held April 11-12, 2012 in Beijing, China.