by Anton Shilov
02/11/2013 | 02:03 PM
At the Common Platform Technology Forum last week GlobalFoundries and its partners from the alliance disclosed some of their long-term plans. As expected, both GlobalFoundries and Samsung Semiconductor have no plans to slowdown the evolution of process technology development. GlobalFoundries believes it will ramp up production using 14nm-XM process tech in 2014 and will follow up with 10nm-XM and even 7nm in the next four years.
In a bid to produce more power efficient and therefore more competitive chips for their clients, GlobalFoundries will initiate production using 20nm process technology in 2013 and will be able to ramp up manufacturing using hybrid 14nm-XM process (which combines 14nm FinFET transistors with 20nm back-end-of-line (BEOL) interconnect flow) in 2014. Apparently, there is also 10nm-XM hybrid process (which will utilize 10nm FinFET with 14nm BEOL) in plans for 2015 as well as 7nm technology due in 2015.
In a bid to speed up development and deployment of new process technology, members of the Common Platform alliance (also known as AMD fab club) will start deploying new process technologies before they get approved by IBM itself. In general, this should speed up time-to-market and maturity of the latest manufacturing technologies, even though at higher cost for foundries.
While it is crucially important to develop leading-edge fabrication processes, it is also essential to ensure high production volumes. While GlobalFoundries will be able to process around 190 thousand 300mm wafers per month (including 20nm, 28nm, 32nm, 40nm and other process technologies) by late 2013, its arch-rival Taiwan Semiconductor Manufacturing Company can already process 1.076 million 300mm wafers a month and will further boost output by the end of the year.