TSMC Pulls 16nm FinFET Risk Production to 2013

TSMC to Offer Strong Alternative for Competitors

by Anton Shilov
04/12/2013 | 07:30 PM

Taiwan Semiconductor Manufacturing Co. has pulled risk production of chips using 16nm FinFET manufacturing tech into calendar year 2013, which suggests that it will commence commercial manufacturing a bit earlier than expected. The commitment also shows TSMC’s readiness for leading-edge chip manufacturing in general.

 

“It looks like we have another 7 to 8 years ahead in advances – maybe more – we can see in technology down to 10nm and even 7nm. Moore’s Law is going to go on and we will be there – if anyone pursues it, we will pursue it”, said Morris Chang, founder and chief executive of TSMC, reports EETimes web-site.

According to the report, TSMC speeded up its plans for initial production of its 16nm FinFET process to the end of 2013. The move will put TSMC in line with its major competitor GlobalFoundries with 14nm-like node (14nm-XM) in 2013-2014.

GlobalFoundries' 14nm-XM offering is based on a modular technology architecture that uses a 14nm FinFET devices combined with 20nm-LPM process back-end-of-line (BEOL) interconnect flow. Leveraging the maturity of the 20nm-LPM technology will enable a rapid time-to-market as well as a smooth transition for customers looking to tap the benefits of FinFET system-on-chips as soon as possible.

At the press conference, Mr. Chang, also expressed his desires to to adopt extreme ultraviolet lithography to make 10nm chips starting in late 2015 as well as research e-beam as an alternative.

The legendary chairman of TSMC, who took the CEO role during the economic crisis, remains optimistic about the industry in general.

“Fabless companies probably can enjoy nine percent growth this year, and we are also optimistic about ourselves - we expect growth in the teens,” Mr. Chang is reported to have said.