Intel to Make 22nm Microsemi Corp.’s Chips for Communication, Defense and Aerospace Industries

Intel and Microsemi Ink 22nm Foundry Agreement

by Anton Shilov
05/01/2013 | 11:40 PM

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, this week said it had signed a foundry agreement with Intel Corp. Under the deal, Intel Custom Foundry will product high-performance digital integrated circuits (ICs) and system-on-chip (SoC) solutions for the former using 22nm tri-gate process technology.


"Intel is pleased to manufacture Microsemi's digital IC solutions utilizing Intel's leading 22nm process technology and IP solutions," said Sunit Rikhi, vice president of technology and manufacturing group at Intel.

Consistent with Microsemi's strategy, this agreement signed in January 2013 will leverage the company's comprehensive technology portfolio into higher-performance, higher-dollar value opportunities. Intel's tri-gate transistors provide an unprecedented combination of performance and power efficiency, enabling Microsemi to develop digital ICs for high-performance computing, network acceleration and signal processing applications. Microsemi is currently engaged with customers and has started designs utilizing Intel's 22nm process node with product delivery anticipated to begin in late 2014 to early 2015.

"The high-value applications we address require semiconductor solutions with unique performance and complex functional attributes. Using Intel's innovative process technology and silicon-proven IP will enable us to expand our opportunity in the markets we serve with higher-performance, lower-power digital ICs for the communications and defense markets," said Paul Pickle, executive vice president of Microsemi's integrated circuits group.