by Anton Shilov
07/04/2013 | 10:46 PM
Nikon Corp. has entered into a contract with the research foundation for the State University of New York to provide a 450mm wafer ArF immersion scanner for process development and to be entrusted with wafer patterning subsequently received an order for the system. It is scheduled to be shipped in April 2015.
This 450mm wafer ArF immersion scanner will be used by the member companies of the Global 450 consortium (G450C) headquartered in the college of nanoscale science and engineering (CNSE) for process development, characterization and demonstrations. Nikon will provide lithography solutions by sending its engineers to G450C. Nikon aims for the standardization of 450mm wafer ArF immersion scanners by offering early opportunities to develop 450mm process.
Announced in September 2011 and located in the Albany NanoTech Complex at CNSE, G450C is a joint effort by five of the world premier companies, Intel, IBM, GlobalFoundries, Taiwan Semiconductor Manufacturing Co. and Samsung, involved in the next generation of computer chip technologies.
Nikon recently released the NSR-S320F, which employs the Streamlign platform, to deliver enhanced overlay accuracy and significantly higher throughput for dry ArF layers. This proven platform provides simplified system setup and maintenance, and delivers optimal scanner stability to reduce cost of ownership.
The goal of G450C is to support the industry transition from 300mm to the 450mm wafer platform, a crucial tipping point for the semiconductor manufacturing process, as smooth as possible. G450C plans to build state-of-the-art infrastructure in the Albany NanoTech Complex to demonstrate the capabilities of 450mm wafer platform and process.
The closure of this contract followed the recent orders Nikon has received from a major device manufacturer for the 450mm ArF immersion scanners.
Nikon believes it is a result of Nikon's development program having won the approval and confidence of the industry. Nikon expects to see increased orders for its systems from other device manufacturers in time for shipments of high volume manufacturing systems scheduled in 2017.