USB 3.1 10Gb/s Specifications Gets Published, Available for Developers

SuperSpeed USB 10Gb/s – Ready for Development

by Anton Shilov
07/31/2013 | 10:53 PM

The USB 3.0 Promoter Group on Wednesday announced the completion of the USB 3.1 specification which adds enhancements to enable SuperSpeed USB to operate at up to 10Gb/s. This latest release of the specification will be available today for download from the USB implementers forum (USB-IF) website.

 

“The USB 3.1 specification primarily extends existing USB 3.0 protocol and hub operation for speed scaling along with defining the next higher physical layer speed as 10Gb/s. The specification team worked hard to make sure that the changes made to support higher speeds were limited and remained consistent with existing USB 3.0 architecture to ease product development,” said Brad Saunders, USB 3.0 promoter group chairman.  

SuperSpeed USB 10Gb/s uses a more efficient data encoding and will deliver more than twice the effective data through-put performance of existing SuperSpeed USB over enhanced, fully backward compatible USB connectors and cables. Compatibility is assured with existing USB 3.0 software stacks and device class protocols as well as with existing 5Gb/s hubs and devices and USB 2.0 products.

“The industry has affirmed the strong demand for higher through-put, for user-connected peripherals and docks, by coming together to produce a quality SuperSpeed USB 10Gb/s specification. Intel is fully committed to deliver on this request,” said Alex Peleg, vice president of Intel architecture group.

Developers interested in implementing the new USB 3.1 specification have the opportunity to learn technical details during three developer conferences currently being planned.

“In this multi-device world, the USB 3.1 updates will enable end-users to move content across devices quickly, conveniently and without worrying about compatibility. AMD thanks our engineers as well as the other technology contributors for bringing to market robust innovation that is designed to work seamlessly with new and existing solutions,” said Emile Ianni, corporate vice president of platform solutions engineering at AMD.

Companies like Hewlett-Packard as well as Texas Instruments also announced endorsement of the USB 3.1.