by Anna Filatova
12/10/2001 | 02:28 PM
Kentron Technologies Inc., ST Microelectronics Inc. and Integrated Circuit Systems Inc. (ICS) announced yesterday the new memory modules using QBM technology, which we have already told you about in our news (see this and this news stories).
Why did all the three companies decide to make this announcement simultaneously? The matter is that Kentron will keep doing what they are used to, that is producing memory modules, and STMicro will supply QMB10 chips adding QBM technology support to the ordinary DDR SDRAM DIMM modules. These chips will include PLL from ICS. And that’s it ;-)
As we have already told you in this news story, mass production of the first QBM SDRAM memory modules with the max bandwidth of 3.2GB/sec (PC1600 x 2) and 4.2GB/sec (PC2100 x 2) will start in Q1 2002. Later on, there will appear memory modules with 5.4GB/sec bandwidth (PC2700 x 2), however, Kentron suspects that it will not happen before the beginning of 2003 (which is pretty strange we should say, as PC2700 DDR SDRAM DIMM modules are already available in the market). And the memory modules with 6.4GB/sec bandwidth (PC3200 x 2) are expected to appear together with the mass spreading of the new DDR II standard, i.e. some time in 2004.