by Anna Filatova
02/27/2002 | 04:10 AM
Here comes another announcement from Intel. The company has started serial production of 300mm semiconductor wafers by 0.13-micron at its Fab D1C in Nillsboro (Oregon). These wafers are used to manufacture CPUs, though this point is not exacted (most probably, it will be Pentium 4/Northwood CPUs).
The migration to more capacious wafers will enable Intel to reduce the costs and increase production. First, 300mm wafers will be cut into 2.4 times more chips than 200mm ones. Second, with 300mm wafers it takes Intel 40% less energy and water to manufacture one chip.