News
 

Bookmark and Share

(1) 

PCI-SIG, the organization responsible for PCI Express technology, has announced the release of the PCIe M.2 specification revision 1.0 to its members. The M.2 is a next-generation form-factor for ultra-light and thin platforms; the M.2 architecture increases design flexibility to support high-end performance and enhanced data rates for power-constrained platforms.

As a natural progression from PCIe mini card and PCIe half mini card, the smaller M.2 form factor is designed to meet future market requirements for applications in thin mobile platforms, such as tablets, portable gaming devices, smartphones and devices requiring SSDs. Its extensible design provides scalability for multiple technologies and host interfaces, including Wi-Fi, Bluetooth, SSD and WWAN.

Revision 1.0 M.2 connectors support both single- and double-sided module cards and are available in connectorized or soldered-down forms. The connectorized forms allow single-sided modules for low profile solutions, or dual-sided modules for increased integration within the platform. All soldered-down module cards are single-sided and are intended for use in low profile applications.

Crucial/Micron M500 SSD in M.2 form-factor

The new M.2 specification allows for the manufacturing of larger PCBs, maximizing the use of the card space and leaving behind a minimal footprint. The specification also helps to address the demand for mobile device I/O solutions with new specifications targeted at ultra-light and thin platforms.

“As users switch from legacy PCs to compact mobile devices, their demand for robust and power-efficient computing platforms endures. The M.2 form factor offers tunable I/O technology, allowing developers to create the optimal balance of power and performance in their platform implementations,” said Al Yanes, PCI-SIG chairman and president.

Tags: PCI Express, PCIe, PCIe M.2, M.2, SSD

Discussion

Comments currently: 1
Discussion started: 12/17/13 01:16:46 AM
Latest comment: 12/17/13 01:16:46 AM

[1-1]

1. 
I dig that it's so small, but I await SFF-8639!
0 0 [Posted by: rektide  | Date: 12/17/13 01:16:46 AM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga Graphics Processor

Monday, August 25, 2014

6:05 pm | Chinese Inspur to Sell Mission-Critical Servers with AMD Software, Power 8 Processors. IBM to Enter Chinese Big Data Market with the Help from Inspur

Sunday, August 24, 2014

6:12 pm | Former X-Bit Labs Editor Aims to Wed Tabletop Games with Mobile Platforms. Game Master Wants to Become a New World of Warcraft

Thursday, August 21, 2014

10:59 pm | Khronos Group to Follow DirectX 12 with Cross-Platform Low-Level API. Khronos Unveils Next-Generation OpenGL Initiative

10:33 pm | Avexir Readies 3.40GHz DDR4 Memory Modules. DDR4 Could Hit 3.40GHz This Year

12:10 pm | AMD to Lower Prices of A-Series APUs for Back-to-School Season. New Prices of AMD A-Series APUs Revealed