by Anton Shilov
11/06/2013 | 11:10 PM
Innodisk, a designer and manufacturer of solid-state drives for industrial applications, has announced the FlexiArray SE108. This new storage appliance incorporates eight SSDs to achieve great IOPS in a 1U rack-mount form factor. The technology will be detailed at the forthcoming Supercomputing Conference 2013 later this month.
Innodisk's new FlexiArray product line, powered by Innodisk FlexiRemap technology, boosts IOPS (input/output per second) through Innodisk's advanced SSDs and an optimized OS – breaking the I/O storage bottleneck, without breaking the bank. FlexiRemap technology, Innodisk's innovation in system software and SSD firmware design, greatly improves performance of random write operations.
Innodisk FlexiArray is an enterprise-grade storage appliance designed to provide cost effective performance for high performance computing, cloud computing, and I/O bound server applications. Typical application areas include cloud computing, virtualization, and high performance computing. Initial products in the FlexiArray series include the slim SE108 for up to 2TB of storage in a 1U rack-mount package, and the powerful HD224, offering up to 8TB in a 2U rack-mount unit, with 8 x 10GbE SFP+ interfaces. Both units offer redundant hot-swappable SSDs and power modules.
Unlike existing proprietary technologies that are expensive and custom-built for each application, Innodisk offers a cost-effective, enterprise-grade storage solution for customers that need high-speed data access. Innodisk FlexiRemap technology deals with the challenges of I/O performance, data endurance, and affordability through innovation in software and firmware, creating a new category of flash-collaborating storage appliances (in contrast to flash-aware or flash-optimized) that will deliver sustained high IOPS, even for random write operations.
FlexiArray features flash-collaborating architecture, sustained high IOPS for random writes, data protection groups, cross-drive wear leveling for optimum health and life span, and standardized, hot-swappable components in rack-mount form factors.