Hardware news tagged 10nm
Wednesday, April 10, 2013
Samsung Aims SSDs with Mass Production of 128Gb TLC NAND Flash.
Samsung Uses 10nm-Class Process Tech to Make 128Gb TLC NAND Flash Memory
Friday, March 8, 2013
Intel Seeks Additional Professionals for Custom Foundry Division.
Intel Confirms: Contract Manufacturing Business Needs New Employees
Thursday, March 7, 2013
Apple and Intel Have Discussed Foundry Deal – Media Report.
New Chief Executive of Intel May Be More Active Regarding Foundry Business
Wednesday, March 6, 2013
Financial Analyst: EUV May Be Late Again and See Limited Usage.
ASML May Further Suffer From EUV Lithography Delays
Thursday, February 28, 2013
WD’s HGST Promises to Double HDD Capacities with 10nm Patterned-Bit Recording Tech.
Western Digital’s HGST Reaches 10nm Patterned-Bit Milestone
Sunday, February 17, 2013
Intel’s Israeli Fab Looking Forward to Make 10nm Chips.
Intel’s Post-14nm Future Begins to Take Shape
Monday, February 11, 2013
GlobalFoundries: 10nm Process on Track for 2015, 7nm Fabrication Technology Due in 2017.
GlobalFoundries Discloses Long-Term Roadmap
Thursday, December 20, 2012
TSMC Confirms Plans to Build a Semiconductor Fab in the U.S.
TSMC Set to Expand Global Presence to Satisfy Different Clients
Wednesday, November 21, 2012
TSMC Rumoured to Build Semiconductor Manufacturing Facility in the U.S.
TSMC May Build Large Fab in the U.S. to Compete for Fabless Clients like Apple
Tuesday, November 6, 2012
TDK’s New Embedded SSD Controller Supports 10nm-Class NAND Flash, 1TB Drives.
TDK Develops New Controller for Embedded SSDs
Thursday, October 25, 2012
TSMC: 450mm Fabs and EUV Lithography Critically Important for 10nm, 7nm Nodes.
TSMC to Build Center to Research and Develop 7nm Process Technology, 450mm Manufacturing
Monday, October 22, 2012
TSMC Lays Process Technology Roadmap Out.
TSMC’s Roadmap Points to 16nm in 2014, 10nm in 2016
Tuesday, October 2, 2012
IBM and Globalfoundries to Use High-Productivity Combinatorial Tech for Development of Next-Gen Nodes.
IBM and Globalfoundries Team Up with Intermolecular for Next-Gen Nodes