Hardware news tagged 10nm
Wednesday, November 21, 2012
TSMC Rumoured to Build Semiconductor Manufacturing Facility in the U.S.
TSMC May Build Large Fab in the U.S. to Compete for Fabless Clients like Apple
Tuesday, November 6, 2012
TDK’s New Embedded SSD Controller Supports 10nm-Class NAND Flash, 1TB Drives.
TDK Develops New Controller for Embedded SSDs
Thursday, October 25, 2012
TSMC: 450mm Fabs and EUV Lithography Critically Important for 10nm, 7nm Nodes.
TSMC to Build Center to Research and Develop 7nm Process Technology, 450mm Manufacturing
Monday, October 22, 2012
TSMC Lays Process Technology Roadmap Out.
TSMC’s Roadmap Points to 16nm in 2014, 10nm in 2016
Tuesday, October 2, 2012
IBM and Globalfoundries to Use High-Productivity Combinatorial Tech for Development of Next-Gen Nodes.
IBM and Globalfoundries Team Up with Intermolecular for Next-Gen Nodes
Tuesday, September 11, 2012
Samsung Starts to Build 10nm NAND Flash Manufacturing Complex in China.
Samsung Breaks Ground for $2.3 Billion NAND Flash Facility in Xi'an, China
Wednesday, September 5, 2012
TSMC to Start 450mm Production in 2018 - Company.
TSMC and 450mm Manufacturing: Six Years to Go
Monday, June 25, 2012
Seagate to Develop Consumer and Enterprise Solid-State Drives with DensBits.
Seagate to Design SSDs with 10nm-Class TLC, MLC NAND Flash Memory
Wednesday, May 2, 2012
As Latest SSD Prices Hit $0.65 per Gigabyte, OCZ Forecasts Further Drop of Costs.
OCZ: New SSD Products Hit $0.65 per Gigabyte, More Cost-Cutting Options Available
Tuesday, April 3, 2012
Samsung Set to Manufacture 10nm-Class NAND Flash, Other Chips in China.
Samsung to Invest $7 Billion into Chinese Memory Plants over Next Several Years
Wednesday, October 5, 2011
Transition to 450mm Semiconductor Wafers Finaly Gains Traction - Analysts.
Future Horizons: 450mm Semiconductor Fabs Will Become Inevitable Elements of Industry
Tuesday, September 27, 2011
Leading Semiconductor Companies to Invest $4.4 Billion in Nanotechnology R&D in New York.
Intel, IBM, Globalfoundries, TSMC and Samsung to Research New Process Technologies, 450mm Manufacturing on New York, USA
Tuesday, July 26, 2011
Intel Readies Skylake Micro-Architecture: Post-Haswell Era Begins to Shape.
Intel's Skylake, Skymont to Arrive in 2016 and 2017 at 14nm and 10nm Nodes
Friday, January 28, 2011
SanDisk, Toshiba Gearing Up for 10nm-Class Process Technology for Flash Memory.
SanDisk to Start Investments into 10nm-Class Fabrication Process in 2011
Thursday, December 9, 2010
Intel Confirms 450mm Nature of New Production Facility.
Intel D1X Fab Is "Compatible" with 450mm Production Equipment
Sunday, October 31, 2010
Intel, Toshiba and Samsung to Jointly Develop 10nm Process Technology - Report.
New Semiconductor Alliance May Be Formed
Monday, October 25, 2010
Intel's D1X Fab to Be Ready for 450mm Wafers - Report.
Intel's Next-Gen Development Fab Will Be Able to Use 450mm Wafers