
Tags
Hardware news tagged 10nm
Monday, June 25, 2012
Seagate to Develop Consumer and Enterprise Solid-State Drives with DensBits.
[10:18 pm]
Seagate to Design SSDs with 10nm-Class TLC, MLC NAND Flash Memory
Wednesday, May 2, 2012
As Latest SSD Prices Hit $0.65 per Gigabyte, OCZ Forecasts Further Drop of Costs.
[10:09 pm]
OCZ: New SSD Products Hit $0.65 per Gigabyte, More Cost-Cutting Options Available
Tuesday, April 3, 2012
Samsung Set to Manufacture 10nm-Class NAND Flash, Other Chips in China.
[11:51 pm]
Samsung to Invest $7 Billion into Chinese Memory Plants over Next Several Years
Wednesday, October 5, 2011
Transition to 450mm Semiconductor Wafers Finaly Gains Traction - Analysts.
[1:33 pm]
Future Horizons: 450mm Semiconductor Fabs Will Become Inevitable Elements of Industry
Tuesday, September 27, 2011
Leading Semiconductor Companies to Invest $4.4 Billion in Nanotechnology R&D in New York.
[8:53 pm]
Intel, IBM, Globalfoundries, TSMC and Samsung to Research New Process Technologies, 450mm Manufacturing on New York, USA
Tuesday, July 26, 2011
Intel Readies Skylake Micro-Architecture: Post-Haswell Era Begins to Shape.
[5:40 pm]
Intel's Skylake, Skymont to Arrive in 2016 and 2017 at 14nm and 10nm Nodes
Friday, January 28, 2011
SanDisk, Toshiba Gearing Up for 10nm-Class Process Technology for Flash Memory.
[11:06 am]
SanDisk to Start Investments into 10nm-Class Fabrication Process in 2011
Thursday, December 9, 2010
Intel Confirms 450mm Nature of New Production Facility.
[1:23 pm]
Intel D1X Fab Is "Compatible" with 450mm Production Equipment
Sunday, October 31, 2010
Intel, Toshiba and Samsung to Jointly Develop 10nm Process Technology - Report.
[1:26 pm]
New Semiconductor Alliance May Be Formed
Monday, October 25, 2010
Intel's D1X Fab to Be Ready for 450mm Wafers - Report.
[10:25 pm]
Intel's Next-Gen Development Fab Will Be Able to Use 450mm Wafers




