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Hardware news tagged 16nm
Wednesday, April 17, 2013
ASML: EUV Tools Are Making Progress, But Chip Manufacturing Will Slip to 2015.
ASML Receives Additional Orders for EUV Equipment
Friday, April 12, 2013
TSMC Pulls 16nm FinFET Risk Production to 2013.
TSMC to Offer Strong Alternative for Competitors
Tuesday, April 2, 2013
ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology.
TSMC Produces World’s First ARM Cortex-A57 64-Bit Chip Using 16nm FinFET Technology
Thursday, December 27, 2012
Intel to Offer Nine Types of Haswell Processors in Four Types of Packages.
Intel May Still Offer Broadwell Chips in LGA1150 Packaging
Thursday, November 29, 2012
TSMC Breaks Ground to Build 16nm FinFET Fab.
TSMC Begins to Build Fab 14 Phase 6 Fab, Reveals Plans for Phase 7 Factory
Monday, October 22, 2012
TSMC Lays Process Technology Roadmap Out.
TSMC’s Roadmap Points to 16nm in 2014, 10nm in 2016
Wednesday, October 17, 2012
ASML and Cymer Provide Status Update Regarding Development of EUV Lithography Tools.
ASML Continues to Expect Commercial EUV Tools in 2014
ASML to Buy Lithography Light Source Maker
Wednesday, September 12, 2012
TSMC to Spend $10 Billion on Capital Expenditure in 2013 - Report.
TSMC's CapEx to Increase to $10 Billion Next Year
Wednesday, September 5, 2012
TSMC to Start 450mm Production in 2018 - Company.
TSMC and 450mm Manufacturing: Six Years to Go
Tuesday, July 24, 2012
TSMC Believes It Makes Sense to Dedicate Fabs to Particular Customers.
TSMC May Start Building Dedicated Fabs for Certain Clients
Monday, July 23, 2012
ARM and TSMC Collaborate to Optimize Next-Generation 64-bit ARM Processors for FinFET Process Technology.
TSMC to Make ARMv8 64-Bit Microprocessors Using 16nm FinFET Process Tech
Wednesday, April 18, 2012
TSMC to Offer Only One Version of 20nm Process Technology.
TSMC Looking Forward at 18nm, 16nm Half-Nodes
Thursday, November 24, 2011
Globalfoundries Delays Plans to Build Fab in Abu Dhabi.
Globalfoundries Cancels Plans to Start Abu Dhabi Fab Construction in 2012
Wednesday, January 12, 2011
IBM and Samsung to Jointly Explore New Semiconductor Materials for Sub-20nm Processes.
IBM, Samsung to Research New Materials, Manufacturing Processes
Thursday, December 9, 2010
Intel Confirms 450mm Nature of New Production Facility.
Intel D1X Fab Is "Compatible" with 450mm Production Equipment
Thursday, November 11, 2010
AMD to Use Half-Node Process Technologies for Low-Power APUs.
AMD Discloses Process Technology Roadmap
Monday, October 25, 2010
Intel's D1X Fab to Be Ready for 450mm Wafers - Report.
Intel's Next-Gen Development Fab Will Be Able to Use 450mm Wafers
Tuesday, June 16, 2009
Toshiba Announces Gate Stack Technology for 16nm Chips and Beyond.
Toshiba’s New Gate Stack Tech to Enable Chips at 16nm Node
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