Hardware news tagged 300mm
Wednesday, May 15, 2013
TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality.
TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors
Monday, April 15, 2013
TSMC: We Have Not Made a Decision to Build a Fab in the U.S.
TSMC Remains Cautious About Building a Fab in the U.S.
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Sunday, February 17, 2013
Intel’s Israeli Fab Looking Forward to Make 10nm Chips.
Intel’s Post-14nm Future Begins to Take Shape
Thursday, February 14, 2013
Researchers Develop Low-Cost Passivation Method, Polymer Coating for Silicon Wafers.
Scientists Find Another Way to Make Silicon Wafers Cheaper
Tuesday, January 29, 2013
Globalfoundries Expected to Apply for Permission to Build Fab 8 Module 2.
Globalfoundries to Start Making Preparations for Assumed 450mm Fab Shortly
Friday, January 25, 2013
Intel: Final Decision Regarding Conversion of Fab 24 Has Not Been Made.
Ireland Okays New Intel Fab, But Intel’s Plans Not Finalized
Monday, January 21, 2013
TSMC: Demand for 20nm Chips Will Be Higher Than Demand for 28nm Chips Nowadays.
TSMC Foresees Rapid Ramp of 20nm Capacities in 2013 and 2014
Friday, January 18, 2013
Intel on Track to Start Making 14nm “Broadwell” Chips in 2013.
Intel Begins Transition to 14nm Manufacturing Process This Year
Wednesday, January 16, 2013
TSMC, GlobalFoundries and Samsung Lead Chip Foundry Rankings in 2012.
GlobalFoundries and Samsung Leave UMC Behind, TSMC Still Leads Contract Semiconductor Market
Tuesday, January 15, 2013
GlobalFoundries Touts $10 Billion Fab 8 Module 2.
GlobalFoundries Looks Forward Second Module of Fab 8
Tuesday, January 8, 2013
GlobalFoundries to Build $2 Billion R&D Facility in New York.
GlobalFoundries to Establish Massive R&D Center Near Fab 8
Thursday, December 20, 2012
TSMC Confirms Plans to Build a Semiconductor Fab in the U.S.
TSMC Set to Expand Global Presence to Satisfy Different Clients
Saturday, December 15, 2012
TSMC to Boost Capital Expenditures in 2013 to Record $9 Billion.
World’s Largest Foundry Ups CapEx from $8.3 to $9 Billion per Year
Thursday, December 13, 2012
Samsung on Track to Produce 28nm Chips at Austin Facility in 2013.
Samsung Set to Continue to Invest into Expansion of Austin, Texas Factory
Thursday, December 6, 2012
TSMC’s Output of 28nm Chips Exceeds Projections – Report.
TSMC Ramps Up 28nm Capacity Ahead of Plans
Thursday, November 29, 2012
TSMC Breaks Ground to Build 16nm FinFET Fab.
TSMC Begins to Build Fab 14 Phase 6 Fab, Reveals Plans for Phase 7 Factory
Wednesday, November 21, 2012
TSMC Rumoured to Build Semiconductor Manufacturing Facility in the U.S.
TSMC May Build Large Fab in the U.S. to Compete for Fabless Clients like Apple
Tuesday, November 20, 2012
UMC Gets New Chief Exec After Restructuring of Management Team.
UMC Replaces Chief Executive Officer with 300mm Production Specialist
Friday, November 2, 2012
UMC to Develop 14nm FinFET Process Tech with 20nm Back-End.
UMC Follows Globalfoundries with Hybrid 14nm FinFET