Hardware news tagged 300mm
Tuesday, August 6, 2013
TSMC Slightly Reschedules Volume Production Using 20nm Process Technology to Early 2014.
TSMC to Start 20nm Volume Production in February, 2014, at Fab 14/Phase 5
Wednesday, May 15, 2013
TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality.
TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors
Monday, April 15, 2013
TSMC: We Have Not Made a Decision to Build a Fab in the U.S.
TSMC Remains Cautious About Building a Fab in the U.S.
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Sunday, February 17, 2013
Intel’s Israeli Fab Looking Forward to Make 10nm Chips.
Intel’s Post-14nm Future Begins to Take Shape
Thursday, February 14, 2013
Researchers Develop Low-Cost Passivation Method, Polymer Coating for Silicon Wafers.
Scientists Find Another Way to Make Silicon Wafers Cheaper