Hardware news tagged 300mm

Tuesday, August 6, 2013

TSMC Slightly Reschedules Volume Production Using 20nm Process Technology to Early 2014. {keywords}
[2:48 pm]

TSMC to Start 20nm Volume Production in February, 2014, at Fab 14/Phase 5


Wednesday, May 15, 2013

TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality. {keywords}
[10:58 am]

TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors


Monday, April 15, 2013

TSMC: We Have Not Made a Decision to Build a Fab in the U.S. {keywords}
[2:44 pm]

TSMC Remains Cautious About Building a Fab in the U.S.


Thursday, April 4, 2013

TSMC Is Ahead of Its Own 20nm Roadmap – Report . {keywords}
[5:35 am]

TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans


Wednesday, March 27, 2013

TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan. {keywords}
[2:50 pm]

Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear


Sunday, February 17, 2013

Intel’s Israeli Fab Looking Forward to Make 10nm Chips. {keywords}
[1:08 pm]

Intel’s Post-14nm Future Begins to Take Shape


Thursday, February 14, 2013

Researchers Develop Low-Cost Passivation Method, Polymer Coating for Silicon Wafers. {keywords}
[1:58 pm]

Scientists Find Another Way to Make Silicon Wafers Cheaper