Hardware news tagged 300mm
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Sunday, February 17, 2013
Intel’s Israeli Fab Looking Forward to Make 10nm Chips.
Intel’s Post-14nm Future Begins to Take Shape
Thursday, February 14, 2013
Researchers Develop Low-Cost Passivation Method, Polymer Coating for Silicon Wafers.
Scientists Find Another Way to Make Silicon Wafers Cheaper
Tuesday, January 29, 2013
Globalfoundries Expected to Apply for Permission to Build Fab 8 Module 2.
Globalfoundries to Start Making Preparations for Assumed 450mm Fab Shortly
Friday, January 25, 2013
Intel: Final Decision Regarding Conversion of Fab 24 Has Not Been Made.
Ireland Okays New Intel Fab, But Intel’s Plans Not Finalized
Monday, January 21, 2013
TSMC: Demand for 20nm Chips Will Be Higher Than Demand for 28nm Chips Nowadays.
TSMC Foresees Rapid Ramp of 20nm Capacities in 2013 and 2014