Hardware news tagged 300mm

Thursday, April 4, 2013

TSMC Is Ahead of Its Own 20nm Roadmap – Report . {keywords}
[5:35 am]

TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans


Wednesday, March 27, 2013

TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan. {keywords}
[2:50 pm]

Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear


Sunday, February 17, 2013

Intel’s Israeli Fab Looking Forward to Make 10nm Chips. {keywords}
[1:08 pm]

Intel’s Post-14nm Future Begins to Take Shape


Thursday, February 14, 2013

Researchers Develop Low-Cost Passivation Method, Polymer Coating for Silicon Wafers. {keywords}
[1:58 pm]

Scientists Find Another Way to Make Silicon Wafers Cheaper


Tuesday, January 29, 2013

Globalfoundries Expected to Apply for Permission to Build Fab 8 Module 2. {keywords}
[1:46 pm]

Globalfoundries to Start Making Preparations for Assumed 450mm Fab Shortly


Friday, January 25, 2013

Intel: Final Decision Regarding Conversion of Fab 24 Has Not Been Made. {keywords}
[4:09 am]

Ireland Okays New Intel Fab, But Intel’s Plans Not Finalized


Monday, January 21, 2013

TSMC: Demand for 20nm Chips Will Be Higher Than Demand for 28nm Chips Nowadays. {keywords}
[1:10 pm]

TSMC Foresees Rapid Ramp of 20nm Capacities in 2013 and 2014