Hardware news tagged 40nm
Tuesday, October 22, 2013
TSMC Earns Record Revenues and Income as 28nm Accounts for Even Larger Portion of Sales.
TSMC’s Revenue Rise to $5.53 Billion As Customers Increase Adoption of Leading-Edge Technologies
Tuesday, August 6, 2013
28nm Chips Account for Nearly One Third of TSMC’s Wafer Revenue.
TSMC’s Q2 2013 28nm Revenue Total $5.19 Billion
Thursday, June 13, 2013
Toshiba Develops World’s First Multi-Level-Cell Structure MROM Cell.
Toshiba Creates MLC MROM Device to Store Firmware of Smartphones and Tablets
Monday, April 29, 2013
Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology.
Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Monday, January 21, 2013
TSMC’s Sales of 28nm Chips in Fourth Quarter Totaled Nearly $1 Billion.
28nm Chips Now Represent Nearly a Quarter of TSMC’s Wafer Revenue
Monday, January 7, 2013
AMD Reveals Client APUs for 2013: Richland, Kabini, Temash and Kaveri.
AMD Demonstrates Working Kabini and Temash APUs, Begins to Ship Richland Chips
Thursday, December 13, 2012
AMD: We Would Like to Use Process Technologies for Longer Periods of Time.
AMD Unsure About Transition Timeframe to 20nm Node
Sunday, December 9, 2012
Chief Executive of AMD: We Are Not Interested in Low-Volume Customers.
AMD Interested Only in High-Volume Design Wins
Tuesday, November 20, 2012
Fujitsu and Oracle to Reveal More Details About 16-Core SPARC Chips at Tech Conference.
Lack of Speedy Innovation Calls Fujitsu and Oracle to Discuss Already Known Chips at ISSCC
Thursday, October 25, 2012
TSMC Increases Output of 28nm Chips by Two Times in One Quarter.
28nm Production Now Accounts for 13% of TSMC Revenue
Wednesday, July 25, 2012
TSMC Boosts Output of 28nm Chips by Nearly 70% in the Second Quarter.
TSMC Plans to Make 68 Thousand 300mm Wafers Using 28nm Process by Year End
Tuesday, July 17, 2012
Oracle and Fujitsu to Unveil Sixteen-Core SPARC Chips at Conference in August.
New SPARC Chips to Be Described at Hot Chips Symposium
Tuesday, June 5, 2012
AMD Debuts New Brazos 2.0 Platform for Netbooks, Low-Cost Laptops.
AMD Formally Unveils Brazos 2.0 Platform for Low-Cost PCs
Monday, May 28, 2012
TSMC to Make Chips for Renesas.
Renesas Electronics and TSMC Sign Pact for Ecosystem for Microcontrollers
Tuesday, May 1, 2012
TSMC Increases Shipments of 28nm Wafers by More Than Two Times in One Quarter.
TSMC Significantly Boosts Output of Leading-Edge Chips, But They Are Still in Shortage
Thursday, April 19, 2012
Nvidia Quietly Pre-Announces Tegra 3+ System-on-Chip.
Nvidia to Boost Performance of Mobile Devices with Tegra 3+
AMD Set to Release New Low-Cost PC Platform Shortly
Friday, February 24, 2012
Nvidia Pre-Announces 4G/LTE Smartphones with Tegra 3.
Nvidia Teams Up with GCT, Renesas for Next-Generation Smartphones
Wednesday, February 22, 2012
Nvidia Rebrands Tegra 3 Architecture into "4-Plus-1".
Nvidia Emphasizes Heterogeneous Nature of Tegra 3 SoCs
Thursday, January 19, 2012
TSMC Ships More 28nm Wafers than Expected, Projects Rapid Ramp.
TSMC Revenue Drops as Market Demand Softens