Hardware news tagged DRAM
Monday, March 3, 2014
HMCC Boosts Bandwidth of Hybrid Memory Cube to 480GB/s.
HMC Consortium Reveals Hybrid Memory Cube 2.0 Spec
Wednesday, February 12, 2014
Innodisk to Sell Memory Modules with Conformal Coatings.
Innodisk to Offer DRAM Modules for Extreme Systems
Thursday, January 16, 2014
Contract DRAM Prices Drop in the First Half of January – Market Tracker.
As SK Hynix’s DRAM Output Returns to Normal Levels, DRAM Prices Get Lower
Wednesday, January 8, 2014
Micron Is Sampling LPDDR4 Chips with Customers – President.
Micron May Be the First Company to Ship Commercial LPDDR4
Tuesday, January 7, 2014
Rambus and Samsung Sign New Technology Licensing Agreement.
Samsung and Rambus Ink Ten Years Technology Licensing Agreement
Friday, January 3, 2014
DDR4 Memory Standard Faces Updates Ahead of Commercialization.
JEDEC Wants “Little More Tuning” of Next-Gen DRAM Standard
Monday, December 30, 2013
SK Hynix Begins to Ship LPDDR4 Samples to Customers.
SK Hynix Reveals Its First LPDDR4 Chips
Samsung Reveals Next-Generation Memory for Mobile Devices
Wednesday, December 18, 2013
SK Hynix to Build New DRAM Plant in South Korea.
SK Hynix to Expand Production of DRAM
Tuesday, December 17, 2013
Release of LPDDR4 Standard Due Next Year, But Adoption Will Unlikely Be Fast.
LPDDR4 Could Eventually Hit 4266Mb/s Data Rate
Monday, December 16, 2013
Micron to Solve DRAM Timing Challenge with Broadcom.
Collaboration Addresses Persistent DDR3 tFAW Timing Constraint
Monday, December 9, 2013
Micron and Rambus Settle All Legal Disputes.
Rambus and Micron Sign License Agreement
Thursday, October 17, 2013
DRAM Makers Prosper Despite of Slow Demand for Personal Computers.
Profits of DRAM Makers Soar to 11-Quarter High – Report