Hardware news tagged Globalfoundries
Monday, December 2, 2013
Successor of AMD Kaveri to Feature Excavator Cores, Set to Emerge in 2015.
AMD’s Longer-Term Roadmap Takes More Definite Shape
Wednesday, November 27, 2013
GlobalFoundries Teams Up with Two Institutes to Develop MEMS for Various Applications.
GlobalFoundries, Abu Dhabi and Singapore Create MEMS Twin Lab
Wednesday, November 13, 2013
GlobalFoundries May Land Chip Manufacturing Orders from Apple.
GlobalFoundries and Samsung to Fight Against TSMC Together
Tuesday, October 29, 2013
Semiconductor Manufacturers Intensify Purchases to Ramp Up Production on 20nm, 16nm, 14nm and 10nm Process Technologies - ASML.
ASML: Commercial EUV Scanners On Track for 2015
Thursday, October 17, 2013
AMD to Tape Out First 20nm, 14nm FinFET Chips Within Next Two Quarters.
AMD Preps to Adopt Leading-Edge Process Technologies
Wednesday, September 4, 2013
Globalfoundries Authorized to Expand Its Fab 8 in New York State.
Globalfoundries’ Fab 8 Module 2 Gets Okay from Authorities
Thursday, August 29, 2013
DARPA Expert Believes Moore’s Law to Remain Viable Till 2020 - 2022.
7nm or 5nm Process Technologies Could Mean the End of Moore’s Law
Thursday, July 4, 2013
Nikon to Ship Commercial 450mm Wafer Scanner in 2017 – Company.
Nikon Receives Order for ArF Immersion Scanner for 450mm Wafers
Tuesday, July 2, 2013
AMD Still Has No Smartphone Plans – Company.
AMD: We Have No Plans for Smartphone Chips
Friday, June 21, 2013
Semiconductor Manufacturing Equipment Spending to Decline 5.5% in 2013.
As Demand for Chips Grows, Spending on Manufacturing Equipment Declines
Tuesday, June 18, 2013
GlobalFoundries to Make Application Processors for RockChip.
RockChip to Address Tablet SoC Market with 28nm Chips Made by GlobalFoundries
Thursday, May 30, 2013
GlobalFoundries Accelerates Adoption of 20nm-LPM and 14nm-XM FinFET Processes with New Design Flows.
GlobalFoundries Unveils New Design Flows for 20nm-LPM and 14nm-XM FinFET Processes
Tuesday, May 21, 2013
Imec, GlobalFoundries and Qualcomm Team Up for High-Density STT-MRAM.
Qualcomm Shows Interest in STT-MRAM, Collaboration with GlobalFoundries
Wednesday, May 15, 2013
TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality.
TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors
Wednesday, May 8, 2013
Unknown AMD SoC Features 8 Bulldozer Modules, 1024 Stream Processors, 512-Bit Memory Bus [UPDATED].
Mysterious Block Diagram Shows Ultra-High-Performance AMD System-on-Chip
Monday, May 6, 2013
First Images of AMD Fusion A-Series “Richland” APUs Hit the Web.
AMD to Assemble Chips in China, Not Only Malaysia
Monday, April 29, 2013
Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology.
Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Wednesday, April 3, 2013
The End of Moore’s Law Is on Horizon – AMD.
AMD Reiterates Slow Transition to 20nm Node
Specifications of Hybrid Memory Cube Finalized
Tuesday, April 2, 2013
GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology.
GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process