Hardware news tagged Globalfoundries
Tuesday, May 21, 2013
Imec, GlobalFoundries and Qualcomm Team Up for High-Density STT-MRAM.
Qualcomm Shows Interest in STT-MRAM, Collaboration with GlobalFoundries
Wednesday, May 15, 2013
TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality.
TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors
Wednesday, May 8, 2013
Unknown AMD SoC Features 8 Bulldozer Modules, 1024 Stream Processors, 512-Bit Memory Bus [UPDATED].
Mysterious Block Diagram Shows Ultra-High-Performance AMD System-on-Chip
Monday, May 6, 2013
First Images of AMD Fusion A-Series “Richland” APUs Hit the Web.
AMD to Assemble Chips in China, Not Only Malaysia
Monday, April 29, 2013
Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology.
Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Wednesday, April 3, 2013
The End of Moore’s Law Is on Horizon – AMD.
AMD Reiterates Slow Transition to 20nm Node
Specifications of Hybrid Memory Cube Finalized