Hardware news tagged Globalfoundries

Tuesday, May 21, 2013

Imec, GlobalFoundries and Qualcomm Team Up for High-Density STT-MRAM. {keywords}
[12:20 pm]

Qualcomm Shows Interest in STT-MRAM, Collaboration with GlobalFoundries


Wednesday, May 15, 2013

TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality. {keywords}
[10:58 am]

TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors


Wednesday, May 8, 2013

Unknown AMD SoC Features 8 Bulldozer Modules, 1024 Stream Processors, 512-Bit Memory Bus [UPDATED]. {keywords}
[10:47 am]

Mysterious Block Diagram Shows Ultra-High-Performance AMD System-on-Chip


Monday, May 6, 2013

First Images of AMD Fusion A-Series “Richland” APUs Hit the Web. {keywords}
[1:22 pm]

AMD to Assemble Chips in China, Not Only Malaysia


Monday, April 29, 2013

Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology. {keywords}
[2:51 pm]

Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process


Monday, April 8, 2013

Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries. {keywords}
[2:55 pm]

Majority of Chips Made Using Outdated Process Technologies


Wednesday, April 3, 2013

The End of Moore’s Law Is on Horizon – AMD. {keywords}
[2:15 pm]

AMD Reiterates Slow Transition to 20nm Node

Hybrid Memory Cube Consortium Publishes Final Specification of HMC Technology. {keywords}
[2:15 pm]

Specifications of Hybrid Memory Cube Finalized