Hardware news tagged Globalfoundries

Wednesday, May 15, 2013


TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality. {keywords}
[6:58 pm]

TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors

 

Wednesday, May 8, 2013


Unknown AMD SoC Features 8 Bulldozer Modules, 1024 Stream Processors, 512-Bit Memory Bus [UPDATED]. {keywords}
[6:47 pm]

Mysterious Block Diagram Shows Ultra-High-Performance AMD System-on-Chip

 

Monday, May 6, 2013


First Images of AMD Fusion A-Series “Richland” APUs Hit the Web. {keywords}
[9:22 pm]

AMD to Assemble Chips in China, Not Only Malaysia

 

Monday, April 29, 2013


Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology. {keywords}
[10:51 pm]

Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process

 

Monday, April 8, 2013


Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries. {keywords}
[10:55 pm]

Majority of Chips Made Using Outdated Process Technologies

 

Wednesday, April 3, 2013


The End of Moore’s Law Is on Horizon – AMD. {keywords}
[10:15 pm]

AMD Reiterates Slow Transition to 20nm Node

Hybrid Memory Cube Consortium Publishes Final Specification of HMC Technology. {keywords}
[10:15 pm]

Specifications of Hybrid Memory Cube Finalized