Hardware news tagged NEC
Monday, April 1, 2013
Lenovo Interested to Buy NEC Smartphone Business – Report .
NEC In Talks with Lenovo Over Mobile Phone Unit
Thursday, November 8, 2012
HP Triples Performance of New Mission-Critical Servers with New Itanium Chips.
HP Rolls-Out New Superdome 2 Business Critical Systems, Integrity Blades
Intel Upgrades Mission-Critical Servers with Itanium 9500 “Poulson” Chip
Wednesday, November 30, 2011
IBM and Intel to Talk About Mainstream Optical Chip-to-Chip Communication.
IBM, Intel, Partners Aim to Bring Optical Chip-to-Chip Interconnects to Mainstream
Friday, January 28, 2011
Lenovo and NEC Form PC Joint-Venture.
Lenovo and NEC Create Japan's Largest PC Group
Thursday, January 20, 2011
Lenovo May Acquire Majority Stake in NEC Computers.
Lenovo and NEC May Form PC Joint-Venture
Wednesday, December 29, 2010
European Standard-Setters Finalize Common Phone Charger Specs.
European Commission Welcomes Unified Phone Charger
Thursday, November 11, 2010
Intel, Microsoft and NEC to Jointly Work on Digital Signage Devices.
Intel, Microsoft and NEC Form Strategic Relationship
Wednesday, July 14, 2010
Renesas Intros Low-Power USB 3.0 Controller for Mobile Devices.
Former NEC Electronics Reduces Consumption of USB 3.0 Chip
Thursday, July 8, 2010
NEC Wants to Double Supercomputer Market Share by 2014.
NEC Plans to Sell More Supercomputers in Europe
Thursday, May 20, 2010
AMD to Install Discrete USB 3.0 Controller onto its Reference Designs.
AMD Teams Up with Renesas Electronics to Promote SuperSpeed USB
Wednesday, May 19, 2010
European Commission Fines Memory Makers for Price-Fixing Practices.
European Commission Slaps a $420 Million Fine on DRAM Vendors
Thursday, April 1, 2010
Renesas Electronics Absorbs NEC Electronics, Renesas Tech, Commences Operations.
Japanese Companies Form Large Electronics Conglomerate
Wednesday, March 17, 2010
NEC Electronics Ships Third Millionth USB 3.0 Host Controller.
NEC Plans to Double Production of USB 3.0 Controllers Due to High Demand
Wednesday, February 17, 2010
NEC Develops 2GB/s High-Speed Serial Communication Interface.
NEC’s New Technology Outshines PCI Express 2.0, USB 3.0
Monday, December 21, 2009
Western Digital Teams Up with NEC for USB 3.0 Hard Drives.
NEC and WD to Jointly Promote SuperSpeed USB
Tuesday, November 17, 2009
Intel Teams Up with NEC to Develop Supercomputing Technologies.
Intel and NEC Team Up for High-Performance Computing
Tuesday, September 8, 2009
Mainboard Makers See No Opportunity in Jointly-Designed Japanese Microprocessor.
Mainboard Makers Pessimistic About Japanese Jointly-Developed CPU
Monday, September 7, 2009
Seven Japanese Companies to Develop Microprocessor to Compete Against AMD and Intel.
Japanese Companies to Create Chip to Rival AMD, Intel
Monday, June 29, 2009
European Commission Promises Universal Chargers for Mobile Phones Starting from 2010.
Leading Producers of Mobile Phones Reaffirm Commitment for Universal Cell Phone Chargers
Thursday, June 18, 2009
NEC and Toshiba to Join IBM in 28nm Process Tech Development.
IBM to Help NEC and Toshiba with 28nm Fabrication Process