Hardware news tagged SMIC
Tuesday, October 22, 2013
SMIC Forms Development Group to Design 3D Integrated Circuits.
SMIC to Design 3D Stacked Devices, TSV-Based 2.5D and 3D Systems-in-Package
Thursday, June 20, 2013
Former Intel Executive Joins Chinese Contract Semiconductor Maker’s Board.
Sean Maloney Becomes Non-Executive Director of SMIC
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Wednesday, January 16, 2013
TSMC, GlobalFoundries and Samsung Lead Chip Foundry Rankings in 2012.
GlobalFoundries and Samsung Leave UMC Behind, TSMC Still Leads Contract Semiconductor Market
Wednesday, April 25, 2012
Intel: Fabless Business Model Is Collapsing.
Intel Claims Major Advantages for Owning Factories
Wednesday, March 21, 2012
Chinese Foundry Vows to Start Making 28nm Chips Next Year.
SMIC Develops 28nm Process Technology, Promises to Start Production in 2013
Tuesday, October 6, 2009
Only Three Contract Makers of Semiconductors Set to Remain on the Market – Analysts.
Massive Consolidation Expected on Foundry Market
Tuesday, November 4, 2008
IN BRIEF: TSMC Chairman Calls for Expanding Chip Design Efforts in Mainland China.
TSMC: Design in Mainland China, Manufacture in Taiwan