Hardware news tagged Semiconductor
Thursday, June 13, 2013
UMC Joins IBM “Fab Club” Chip Alliance for 10nm Process Development.
UMC and IBM to Collaborate on Development of 10nm Fabrication Process
Tuesday, June 4, 2013
IBM Develops 5th Generation SiGe Chip Manufacturing Process for Communication Markets.
IBM Preps New Wireless Chip Technology to Allow Mobile Operators to Clear the Data Bottleneck
Thursday, May 30, 2013
GlobalFoundries Accelerates Adoption of 20nm-LPM and 14nm-XM FinFET Processes with New Design Flows.
GlobalFoundries Unveils New Design Flows for 20nm-LPM and 14nm-XM FinFET Processes
Friday, May 24, 2013
New Technique May Open Up an Era of Atomic-Scale Semiconductor Devices.
Atom-Scale Semiconductor Devices May Be Incoming, Thanks to New Researchers
Wednesday, May 22, 2013
MIT Scientists Mix Graphene with Hexagonal Boron Nitride to Create New Material for Computer Chips.
Researchers Create New Material for Semiconductors
Tuesday, May 21, 2013
Imec, GlobalFoundries and Qualcomm Team Up for High-Density STT-MRAM.
Qualcomm Shows Interest in STT-MRAM, Collaboration with GlobalFoundries
Apple, Qualcomm and Samsung Pass AMD in Microprocessor Rankings
Thursday, May 16, 2013
Samsung Develops 45nm Embedded Flash Logic Process Technology.
Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech
Wednesday, May 15, 2013
TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality.
TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors
Wednesday, May 1, 2013
Intel to Make 22nm Microsemi Corp.’s Chips for Communication, Defense and Aerospace Industries.
Intel and Microsemi Ink 22nm Foundry Agreement
Monday, April 29, 2013
Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology.
Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process
Monday, April 22, 2013
ARM: 14nm FinFET Technology Will Enable Higher-Performance and Lower Power Consumption, But There Are Challenges.
Tight Collaboration Will Be Needed to Take Full Advantage of 14nm FinFET and More Advanced Technologies – ARM
Friday, April 19, 2013
ASML On Track to Deliver 450mm Production Equipment in 2015.
ASML Sees Start of 450mm Production in 2018
Wednesday, April 17, 2013
ASML: EUV Tools Are Making Progress, But Chip Manufacturing Will Slip to 2015.
ASML Receives Additional Orders for EUV Equipment
Tuesday, April 16, 2013
Intel: Foundry Business Will Not Have Substantial Revenue Impact for Two to Three Years.
Intel Is Collecting Serious Customers for Its Custom Foundry Division
Monday, April 15, 2013
TSMC: We Have Not Made a Decision to Build a Fab in the U.S.
TSMC Remains Cautious About Building a Fab in the U.S.
Friday, April 12, 2013
TSMC Pulls 16nm FinFET Risk Production to 2013.
TSMC to Offer Strong Alternative for Competitors
Thursday, April 11, 2013
Researchers Develop One-Layer Thick Germanium Sheet: May Replace Silicon in Semiconductors.
Germanane Set to Compete Against Graphene in the Future Chips
Apple Reportedly Works with TSMC on New Application Processor
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans