Hardware news tagged Semiconductor

Tuesday, January 14, 2014


Intel Delays Equipment Move-In at Fab 42, Will Explore Options. {keywords}
[10:50 pm]

Intel Cancels Plans to Make 14nm Chips at Fab 42, Will Wait for Next Process Technologies

 

Monday, January 6, 2014


GlobalFoundries Names Ex-Motorola Mobility CEO Its New Chief Executive Officer. {keywords}
[10:10 pm]

GlobalFoundries Appoints New Chief Executive Officer

 

Wednesday, November 27, 2013


GlobalFoundries Teams Up with Two Institutes to Develop MEMS for Various Applications. {keywords}
[10:33 pm]

GlobalFoundries, Abu Dhabi and Singapore Create MEMS Twin Lab

 

Tuesday, November 26, 2013


Single-Layer Tin Could Go Beyond Graphene, Conducting Electricity with 100% Efficiency. {keywords}
[10:28 pm]

2D Tin Could Be Next Super Material, Say Theorists

 

Wednesday, November 20, 2013


Microsoft to Become One of World’s Leading Chip Buyers on Nokia Acquisition. {keywords}
[10:30 pm]

Microsoft Will Gain Importance on Chip Market After Nokia Takeover

 

Wednesday, November 13, 2013


GlobalFoundries May Land Chip Manufacturing Orders from Apple. {keywords}
[10:56 pm]

GlobalFoundries and Samsung to Fight Against TSMC Together

 

Tuesday, October 29, 2013


Semiconductor Manufacturers Intensify Purchases to Ramp Up Production on 20nm, 16nm, 14nm and 10nm Process Technologies - ASML. {keywords}
[10:50 pm]

ASML: Commercial EUV Scanners On Track for 2015

Intel to Make Quad-Core Low-Power System-on-Chips Based on ARM Architecture. {keywords}
[9:31 pm]

Intel to Manufacture Quad-Core ARM Cortex-A53 SoC for Altera

 

Tuesday, October 22, 2013


TSMC Shares More Details Regarding 16nm FinFET and 20nm Progress. {keywords}
[10:08 pm]

TSMC Has Tens of 20nm and 16nm FinFET Tape-Outs, Everything Goes on Schedule

TSMC Earns Record Revenues and Income as 28nm Accounts for Even Larger Portion of Sales. {keywords}
[9:38 pm]

TSMC’s Revenue Rise to $5.53 Billion As Customers Increase Adoption of Leading-Edge Technologies

SMIC Forms Development Group to Design 3D Integrated Circuits. {keywords}
[9:23 pm]

SMIC to Design 3D Stacked Devices, TSV-Based 2.5D and 3D Systems-in-Package

 

Thursday, October 17, 2013


AMD to Tape Out First 20nm, 14nm FinFET Chips Within Next Two Quarters. {keywords}
[10:10 pm]

AMD Preps to Adopt Leading-Edge Process Technologies

 

Tuesday, October 15, 2013


Intel Will Not Reconsider Timing for 450mm Manufacturing. {keywords}
[10:25 pm]

Intel Has No Plans to Change 450mm Plans Amid Slow Industry

Intel Delays Mass Production of Next-Generation Microprocessor by One Quarter [UPDATED]. {keywords}
[10:00 pm]

Intel to Postpone Production of 14nm Core “Broadwell” Processors to Q1 2014