Hardware news tagged Semiconductor
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans
Wednesday, April 3, 2013
The End of Moore’s Law Is on Horizon – AMD.
AMD Reiterates Slow Transition to 20nm Node
Intel Reportedly Lands Chip Orders from Cisco
Tuesday, April 2, 2013
GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology.
GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process
TSMC Produces World’s First ARM Cortex-A57 64-Bit Chip Using 16nm FinFET Technology
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Monday, March 25, 2013
IBM Scientists Discover New Atomic Technique to Charge Memory Chips.
IBM Discovers New Method for Charging Memory Chips
Tuesday, March 19, 2013
GlobalFoundries Partners with ASML for Leading-edge Chip Tapeouts.
ASML’s Division and GlobalFoundries Team Up to Improve 14nm, 20nm and 28nm Yields
Thursday, March 14, 2013
Intel Leads Unexpectedly Large Decline in Semiconductor Market Inventory – Researchers.
Semiconductor Companies Reduce Inventory Levels by $1 Billion in One Quarter
Monday, March 11, 2013
Intel Considers Sanjay Jha, Patrick Gelsinger onto CEO Role.
Intel Actively Searching for CEO Outside of the Company
Thursday, March 7, 2013
Apple and Intel Have Discussed Foundry Deal – Media Report.
New Chief Executive of Intel May Be More Active Regarding Foundry Business
Wednesday, March 6, 2013
Financial Analyst: EUV May Be Late Again and See Limited Usage.
ASML May Further Suffer From EUV Lithography Delays
Monday, February 25, 2013
Altera to Produce Next-Generation FPGAs at Intel’s Factories.
Intel to Produce FPGAs for Altera Using 14nm Process Tech
Friday, February 22, 2013
Toshiba Cuts Power Consumption of CPU Cache by Up to 85%.
Toshiba Develops Low Power Technology for Embedded SRAM
Sunday, February 17, 2013
Intel’s Israeli Fab Looking Forward to Make 10nm Chips.
Intel’s Post-14nm Future Begins to Take Shape
Thursday, February 14, 2013
Researchers Develop Low-Cost Passivation Method, Polymer Coating for Silicon Wafers.
Scientists Find Another Way to Make Silicon Wafers Cheaper
Monday, February 11, 2013
GlobalFoundries: 10nm Process on Track for 2015, 7nm Fabrication Technology Due in 2017.
GlobalFoundries Discloses Long-Term Roadmap
Thursday, February 7, 2013
Fujitsu and Panasonic to Form a New Chip Designer.
Fujitsu and TSMC to Form a New Foundry Company
Rambus to Design Silicon-Proven Memory and Interface Blocks for 14nm-XM FinFET Tech
Tuesday, February 5, 2013
GlobalFoundries: 14nm-XM Process Tech Two Times More Power-Efficient Than 28nm.
Preliminary Results Show Significant Declines in Power Consumption of 14nm-XM Chips