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Hardware news tagged Semiconductor
Tuesday, April 2, 2013
ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology.
TSMC Produces World’s First ARM Cortex-A57 64-Bit Chip Using 16nm FinFET Technology
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Monday, March 25, 2013
IBM Scientists Discover New Atomic Technique to Charge Memory Chips.
IBM Discovers New Method for Charging Memory Chips
Tuesday, March 19, 2013
GlobalFoundries Partners with ASML for Leading-edge Chip Tapeouts.
ASML’s Division and GlobalFoundries Team Up to Improve 14nm, 20nm and 28nm Yields
Thursday, March 14, 2013
Intel Leads Unexpectedly Large Decline in Semiconductor Market Inventory – Researchers.
Semiconductor Companies Reduce Inventory Levels by $1 Billion in One Quarter
Monday, March 11, 2013
Intel Considers Sanjay Jha, Patrick Gelsinger onto CEO Role.
Intel Actively Searching for CEO Outside of the Company
Thursday, March 7, 2013
Apple and Intel Have Discussed Foundry Deal – Media Report.
New Chief Executive of Intel May Be More Active Regarding Foundry Business
Wednesday, March 6, 2013
Financial Analyst: EUV May Be Late Again and See Limited Usage.
ASML May Further Suffer From EUV Lithography Delays
Monday, February 25, 2013
Altera to Produce Next-Generation FPGAs at Intel’s Factories.
Intel to Produce FPGAs for Altera Using 14nm Process Tech
Friday, February 22, 2013
Toshiba Cuts Power Consumption of CPU Cache by Up to 85%.
Toshiba Develops Low Power Technology for Embedded SRAM
Sunday, February 17, 2013
Intel’s Israeli Fab Looking Forward to Make 10nm Chips.
Intel’s Post-14nm Future Begins to Take Shape
Thursday, February 14, 2013
Researchers Develop Low-Cost Passivation Method, Polymer Coating for Silicon Wafers.
Scientists Find Another Way to Make Silicon Wafers Cheaper
Monday, February 11, 2013
GlobalFoundries: 10nm Process on Track for 2015, 7nm Fabrication Technology Due in 2017.
GlobalFoundries Discloses Long-Term Roadmap
Thursday, February 7, 2013
Fujitsu and Panasonic to Form a New Chip Designer.
Fujitsu and TSMC to Form a New Foundry Company
Rambus to Design Silicon-Proven Memory and Interface Blocks for 14nm-XM FinFET Tech
Tuesday, February 5, 2013
GlobalFoundries: 14nm-XM Process Tech Two Times More Power-Efficient Than 28nm.
Preliminary Results Show Significant Declines in Power Consumption of 14nm-XM Chips
Tuesday, January 29, 2013
Globalfoundries Expected to Apply for Permission to Build Fab 8 Module 2.
Globalfoundries to Start Making Preparations for Assumed 450mm Fab Shortly
Monday, January 28, 2013
Qualcomm and Imec to Continue Shaping Semiconductor Technology Roadmap.
Qualcomm and Imec to Sustain Collaboration on Process Technologies
Friday, January 25, 2013
Intel: Final Decision Regarding Conversion of Fab 24 Has Not Been Made.
Ireland Okays New Intel Fab, But Intel’s Plans Not Finalized
Thursday, January 24, 2013
University Professor Develops Cheaper and Greener Way to Produce Silicon.
New Silicon Production Method Could Slash Chip Prices
Monday, January 21, 2013
TSMC: Demand for 20nm Chips Will Be Higher Than Demand for 28nm Chips Nowadays.
TSMC Foresees Rapid Ramp of 20nm Capacities in 2013 and 2014
28nm Chips Now Represent Nearly a Quarter of TSMC’s Wafer Revenue
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