Hardware news tagged Semiconductor

Thursday, May 16, 2013


Samsung Develops 45nm Embedded Flash Logic Process Technology. {keywords}
[7:56 pm]

Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

 

Wednesday, May 15, 2013


TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality. {keywords}
[6:58 pm]

TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors

 

Wednesday, May 1, 2013


Intel to Make 22nm Microsemi Corp.’s Chips for Communication, Defense and Aerospace Industries. {keywords}
[10:40 pm]

Intel and Microsemi Ink 22nm Foundry Agreement

 

Monday, April 29, 2013


Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology. {keywords}
[10:51 pm]

Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process

 

Monday, April 22, 2013


ARM: 14nm FinFET Technology Will Enable Higher-Performance and Lower Power Consumption, But There Are Challenges. {keywords}
[9:03 am]

Tight Collaboration Will Be Needed to Take Full Advantage of 14nm FinFET and More Advanced Technologies – ARM

 

Friday, April 19, 2013


ASML On Track to Deliver 450mm Production Equipment in 2015. {keywords}
[1:51 pm]

ASML Sees Start of 450mm Production in 2018

 

Wednesday, April 17, 2013


ASML: EUV Tools Are Making Progress, But Chip Manufacturing Will Slip to 2015. {keywords}
[8:38 pm]

ASML Receives Additional Orders for EUV Equipment

 

Tuesday, April 16, 2013


Intel: Foundry Business Will Not Have Substantial Revenue Impact for Two to Three Years. {keywords}
[10:58 pm]

Intel Is Collecting Serious Customers for Its Custom Foundry Division

 

Monday, April 15, 2013


TSMC: We Have Not Made a Decision to Build a Fab in the U.S. {keywords}
[10:44 pm]

TSMC Remains Cautious About Building a Fab in the U.S.

 

Friday, April 12, 2013


TSMC Pulls 16nm FinFET Risk Production to 2013. {keywords}
[6:30 pm]

TSMC to Offer Strong Alternative for Competitors

 

Thursday, April 11, 2013


Researchers Develop One-Layer Thick Germanium Sheet: May Replace Silicon in Semiconductors. {keywords}
[10:10 pm]

Germanane Set to Compete Against Graphene in the Future Chips

Apple Excludes Samsung from New Chip Development Flow – Report. {keywords}
[10:00 pm]

Apple Reportedly Works with TSMC on New Application Processor

 

Monday, April 8, 2013


Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries. {keywords}
[10:55 pm]

Majority of Chips Made Using Outdated Process Technologies

 

Thursday, April 4, 2013


TSMC Is Ahead of Its Own 20nm Roadmap – Report . {keywords}
[1:35 pm]

TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans

 

Wednesday, April 3, 2013


The End of Moore’s Law Is on Horizon – AMD. {keywords}
[10:15 pm]

AMD Reiterates Slow Transition to 20nm Node

Intel Custom Foundry to Manufacture Chips for Cisco. {keywords}
[5:32 pm]

Intel Reportedly Lands Chip Orders from Cisco