Hardware news tagged Semiconductors

Friday, March 8, 2013

Intel Seeks Additional Professionals for Custom Foundry Division. {keywords}
[4:46 pm]

Intel Confirms: Contract Manufacturing Business Needs New Employees


Wednesday, February 18, 2009

Developers of High-End Chips Prefer TSMC over UMC – Report.
[8:30 am]

TSMC’s Advanced Fabrication Processes More Popular than UMC’s


Wednesday, February 11, 2009

UMC May Want to Join IBM’s Bulk Process Alliance. {keywords}
[4:28 pm]

Contract Semiconductor Maker Rumoured to Unify Process Technologies with Others

Intel Describes Peculiarities of 32nm Process Technology.
[4:02 am]

Intel Reveals More Details about 32nm Fabrication Process


Tuesday, February 10, 2009

AMD Delays Shareholder Meeting on Establishment of the Foundry Company.
[12:47 pm]

AMD to Delay Final Fabs Spin Off Vote After Giving Investors Too Short Time to Make Choice

Intel Vows to Invest $7 Billion in U.S. Manufacturing Facilities.
[7:00 am]

Intel Set to Build 32nm Fabs in the U.S.


Wednesday, January 7, 2009

U.S. Authorities Okay Creation of The Foundry Company.
[11:47 am]

Committee on Foreign Investment Clears Path for Creation of “The Foundry Company”


Wednesday, December 10, 2008

IN BRIEF: Intel Completes Development of 32nm Process Technology.
[4:43 pm]

Intel’s 32nm Fabrication Process Is Ready, Claims Company


Monday, December 8, 2008

AMD to Reduce Its Stake in The Foundry Company, to Get Less from Mubadala.
[10:59 am]

AMD, ATIC and Mubadala Amend Transaction Agreements


Wednesday, December 3, 2008

New York State Approves Incentives for The Foundry Company’s Fab.
[10:29 pm]

AMD, TFC Get Help in Fab Building from New York State


Tuesday, December 2, 2008

Chip Suppliers Slash Production Due to Lowering Demand.
[2:25 pm]

Broadcom, Marvell, Nvidia, Others to Cut Production Substantially


Thursday, November 27, 2008

IN BRIEF: Economic Crisis Reportedly Forces Chip Designers to Migrate to Newer Process Technologies.
[12:18 pm]

Fabless Chip Designers Tend to Transit to New Fabrication Processes


Wednesday, November 26, 2008

United Microelectronics Corp. to Use High-K Metal Gate Dielectrics Starting with 32nm Process Tech.
[12:43 pm]

UMC Promises 32nm/28nm Process Technologies in 2010