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Hardware news tagged TSMC
Wednesday, May 15, 2013
TSMC: Moore’s Law Will Survive, But Chips Will Gain Untraditional Functionality.
TSMC Predicts Highly-Packed Chips with Integrated Memory, Flash, Sensors
Wednesday, May 8, 2013
Unknown AMD SoC Features 8 Bulldozer Modules, 1024 Stream Processors, 512-Bit Memory Bus [UPDATED].
Mysterious Block Diagram Shows Ultra-High-Performance AMD System-on-Chip
Friday, April 19, 2013
ASML On Track to Deliver 450mm Production Equipment in 2015.
ASML Sees Start of 450mm Production in 2018
Monday, April 15, 2013
TSMC: We Have Not Made a Decision to Build a Fab in the U.S.
TSMC Remains Cautious About Building a Fab in the U.S.
Friday, April 12, 2013
TSMC Pulls 16nm FinFET Risk Production to 2013.
TSMC to Offer Strong Alternative for Competitors
Thursday, April 11, 2013
Apple Excludes Samsung from New Chip Development Flow – Report.
Apple Reportedly Works with TSMC on New Application Processor
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans
Wednesday, April 3, 2013
The End of Moore’s Law Is on Horizon – AMD.
AMD Reiterates Slow Transition to 20nm Node
Tuesday, April 2, 2013
ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology.
TSMC Produces World’s First ARM Cortex-A57 64-Bit Chip Using 16nm FinFET Technology
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Wednesday, March 20, 2013
Nvidia Readies Yet Another “Titan” Consumer Graphics Card Based on GK110 GPU – Rumour.
Nvidia Reportedly Preps Second Consumer Graphics Card Based on GK110 Graphics Chip
Monday, March 11, 2013
First Images of Alleged Samsung Galaxy S IV Hit the Web.
Web-Site Publishes Samsung Galaxy S IV Photos
Wednesday, March 6, 2013
Financial Analyst: EUV May Be Late Again and See Limited Usage.
ASML May Further Suffer From EUV Lithography Delays
Wednesday, February 27, 2013
Qualcomm First to Use TSMC’s 28HPM Process Technology for High-End Mobile Devices.
Qualcomm Adopts 28HPM Process for Qualcomm 800 System-on-Chips
Tuesday, February 26, 2013
Samsung Sets Launch Date for Galaxy S IV Smartphone.
Samsung to Uncover the Next Galaxy in Mid-March
Monday, February 25, 2013
Altera to Produce Next-Generation FPGAs at Intel’s Factories.
Intel to Produce FPGAs for Altera Using 14nm Process Tech
Sunday, February 24, 2013
Samsung Reportedly Chooses to Use Qualcomm Application Processor for Galaxy S IV Smartphone.
Samsung Decides Not to Utilize Eight-Core Exynos Processor in Galaxy S IV
Friday, February 15, 2013
AMD Changes Radeon Graphics Roadmap, Delays New Product Launches Till Late 2013.
AMD to Focus on Radeon HD 7000 Family for Remainder of 2013, Sea Islands Due Late This Year
Monday, February 11, 2013
GlobalFoundries: 10nm Process on Track for 2015, 7nm Fabrication Technology Due in 2017.
GlobalFoundries Discloses Long-Term Roadmap
Thursday, February 7, 2013
Fujitsu and Panasonic to Form a New Chip Designer.
Fujitsu and TSMC to Form a New Foundry Company
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