Hardware news tagged TSV

Wednesday, August 27, 2014

Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. {keywords}
[1:09 pm]

Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs


Tuesday, October 22, 2013

SMIC Forms Development Group to Design 3D Integrated Circuits. {keywords}
[1:23 pm]

SMIC to Design 3D Stacked Devices, TSV-Based 2.5D and 3D Systems-in-Package


Friday, October 18, 2013

Nvidia Unleashes G-Sync Technology for Gaming Monitors. {keywords}
[12:40 pm]

Nvidia Fights Tears, Stutters and Lag with G-Sync


Tuesday, April 2, 2013

GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology. {keywords}
[1:41 pm]

GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process


Thursday, April 26, 2012

Globalfoundries' Fab 8 to Enable 3D Stacking of Chips. {keywords}
[8:56 am]

Globalfoundries 20nm Process Tech to Support Through-Silicon Vias at Fab 8


Wednesday, August 17, 2011

Samsung Demos 32GB RDIMM with Through Silicon Via Packaging.
[8:10 am]

Samsung Develops 32GB DDR3 RDIMM for Next-Gen Servers


Monday, June 27, 2011

Elpida Develops 8Gb DDR3 Chip Based on Through Silicon Via Technology.
[2:21 pm]

Elpida Begins to Sample 3Gb DDR3 DRAMs Based on TSV Stacking