Hardware news tagged TSV
Wednesday, August 27, 2014
Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules.
Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs
Tuesday, October 22, 2013
SMIC Forms Development Group to Design 3D Integrated Circuits.
SMIC to Design 3D Stacked Devices, TSV-Based 2.5D and 3D Systems-in-Package
Friday, October 18, 2013
Nvidia Unleashes G-Sync Technology for Gaming Monitors.
Nvidia Fights Tears, Stutters and Lag with G-Sync
Tuesday, April 2, 2013
GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology.
GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process
Thursday, April 26, 2012
Globalfoundries' Fab 8 to Enable 3D Stacking of Chips.
Globalfoundries 20nm Process Tech to Support Through-Silicon Vias at Fab 8
Wednesday, August 17, 2011
Samsung Demos 32GB RDIMM with Through Silicon Via Packaging.
Samsung Develops 32GB DDR3 RDIMM for Next-Gen Servers
Monday, June 27, 2011
Elpida Develops 8Gb DDR3 Chip Based on Through Silicon Via Technology.
Elpida Begins to Sample 3Gb DDR3 DRAMs Based on TSV Stacking