Hardware news tagged TSV

Tuesday, April 2, 2013


GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology. {keywords}
[10:41 pm]

GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process

 

Thursday, April 26, 2012


Globalfoundries' Fab 8 to Enable 3D Stacking of Chips. {keywords}
[5:56 pm]

Globalfoundries 20nm Process Tech to Support Through-Silicon Vias at Fab 8

 

Wednesday, August 17, 2011


Samsung Demos 32GB RDIMM with Through Silicon Via Packaging.
[5:10 pm]

Samsung Develops 32GB DDR3 RDIMM for Next-Gen Servers

 

Monday, June 27, 2011


Elpida Develops 8Gb DDR3 Chip Based on Through Silicon Via Technology.
[11:21 pm]

Elpida Begins to Sample 3Gb DDR3 DRAMs Based on TSV Stacking