Hardware news tagged TSV
Tuesday, April 2, 2013
GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology.
GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process
Thursday, April 26, 2012
Globalfoundries' Fab 8 to Enable 3D Stacking of Chips.
Globalfoundries 20nm Process Tech to Support Through-Silicon Vias at Fab 8
Wednesday, August 17, 2011
Samsung Demos 32GB RDIMM with Through Silicon Via Packaging.
Samsung Develops 32GB DDR3 RDIMM for Next-Gen Servers
Monday, June 27, 2011
Elpida Develops 8Gb DDR3 Chip Based on Through Silicon Via Technology.
Elpida Begins to Sample 3Gb DDR3 DRAMs Based on TSV Stacking