Hardware news tagged TSV

Wednesday, August 27, 2014


Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. {keywords}
[9:09 pm]

Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

 

Tuesday, October 22, 2013


SMIC Forms Development Group to Design 3D Integrated Circuits. {keywords}
[9:23 pm]

SMIC to Design 3D Stacked Devices, TSV-Based 2.5D and 3D Systems-in-Package

 

Friday, October 18, 2013


Nvidia Unleashes G-Sync Technology for Gaming Monitors. {keywords}
[8:40 pm]

Nvidia Fights Tears, Stutters and Lag with G-Sync

 

Tuesday, April 2, 2013


GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology. {keywords}
[9:41 pm]

GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process

 

Thursday, April 26, 2012


Globalfoundries' Fab 8 to Enable 3D Stacking of Chips. {keywords}
[4:56 pm]

Globalfoundries 20nm Process Tech to Support Through-Silicon Vias at Fab 8

 

Wednesday, August 17, 2011


Samsung Demos 32GB RDIMM with Through Silicon Via Packaging.
[4:10 pm]

Samsung Develops 32GB DDR3 RDIMM for Next-Gen Servers

 

Monday, June 27, 2011


Elpida Develops 8Gb DDR3 Chip Based on Through Silicon Via Technology.
[10:21 pm]

Elpida Begins to Sample 3Gb DDR3 DRAMs Based on TSV Stacking