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There seems to be some kind of stagnation in the processor air cooling market. Everything they could have invented taking into account the existing component base and size limitations has already been invented that is why it is pretty challenging to increase the cooling efficiency. Nevertheless, there is some improvement happening here and in the next few reviews we are going to talk about solutions like that. Our today’s review, however, will be devoted to the two top cooling solutions from Thermaltake’s ISGC series that seems to be a typical example of how things get stalled in this industry. One can use new names for old technologies, “reinvent” already existing solutions, try to attract potential customers with shining and glowing accessories – there are plenty of things to do. But sometimes we have to test cooling solutions like that too, so that you could make an intelligent buying decision once you face the choice. So, let’s get started.

Thermaltake ISGC-300 (CLP0539)

A small cardboard box used for the new testing participant of our today’s review - Thermaltake ISGC-300 – is simple and informative. There is a photo of the cooler on the front side of the box right next to a beautiful warrior girl with a sword. The back of the box mentions some of the “innovations” implemented in this cooler and fan:

 

Thermaltake ISGC-300 is bundled with everything necessary for successful installation of this solution on all contemporary platforms except LGA1156 (the retention kit can be purchased separately):

ISGC-300 is a tower cooler. It consists of a copper base plate, four copper heatpipes 6 mm in diameter, heatsink of aluminum plates and a 120x120x25 mm fan:

 

 

The aluminum heatsink plates are 0.5 mm thick and the gaps between them are 3 mm big. Overall there are not too many plates, only 33. Look, you can see that the heatsink is smaller than the fan, as there are openings at the top and at the bottom behind the fan:

 

Why didn’t Thermaltake engineers add another five plates at the top and another five at the bottom – hard to tell. But the way it is right now the cooler looks kind of unfinished:

The heatpipes go through the heatsink body not along the straight line but form something like a slight half-circle. Their top ends are covered with plastic caps:

The heatsink is symmetrical. Its sides on airflow entry and exit are of variable height, which not only reduces the airflow resistance but also lowers the noise:

We have already come across a solution like that many times in our tests, for example, in Noctua coolers, that is why it is not that new anymore, though it may seem innovative at first glance.

 
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