Hardware news tagged 450mm
Monday, August 6, 2012
TSMC Acquires 5% Stake in ASML to Accelerate Development of 450mm Manufacturing Tools.
TSMC Joins ASML Customer Co-Investment Program
Tuesday, July 10, 2012
Samsung and TSMC in Talks to Acquire 10% Stake in ASML.
Samsung and TSMC May Also Become ASML Stakeholders to Accelerate 450mm Equipment Development
Monday, July 9, 2012
Intel Buys Stake in ASML to Accelerate Development of 450mm and EUV Manufacturing Tools.
Intel to Invest $4.1 Billion into ASML to Speed Up Creation of 450mm and EUV Semiconductor Manufacturing Equipment
Thursday, April 12, 2012
Nvidia Calls for 450mm Semiconductor Factories.
Nvidia: 450mm Fabs Needed to Make Trillion-Transistor Chips Profitably
Thursday, November 24, 2011
Globalfoundries Delays Plans to Build Fab in Abu Dhabi.
Globalfoundries Cancels Plans to Start Abu Dhabi Fab Construction in 2012
Wednesday, October 5, 2011
Transition to 450mm Semiconductor Wafers Finaly Gains Traction - Analysts.
Future Horizons: 450mm Semiconductor Fabs Will Become Inevitable Elements of Industry
Tuesday, September 27, 2011
Leading Semiconductor Companies to Invest $4.4 Billion in Nanotechnology R&D in New York.
Intel, IBM, Globalfoundries, TSMC and Samsung to Research New Process Technologies, 450mm Manufacturing on New York, USA
Wednesday, August 24, 2011
300mm Semiconductor Wafers Production Capacity to Double by 2015 - Research.
Larger 300mm Wafers Gain Popularity as They Become More Cost-Efficient
Wednesday, July 13, 2011
EVG Unveils Industry’s First Wafer Bonding System for 450mm SOI Wafers.
Soitec Set to Make 450mm SOI Wafers
Thursday, April 7, 2011
TSMC Expects 450mm Fabs to Require Lower Amount of Engineers.
TSMC Sees More Advantages in 450mm Fabs
Tuesday, February 1, 2011
TSMC Plans to Start Making Commercial Products Using 450mm Wafers in 2015 - 2016.
TSMC to Build First Pilot 450mm Line in 2013 - 2014 - Chief Executive
Tuesday, January 25, 2011
Deployment of 450mm Fabs Likely to Face Delays.
450mm Fabs to Be Deployed in 2017 - 2018
Monday, December 20, 2010
TSMC’s Forthcoming Fab May Be Compatible with 450mm Equipment.
TSMC’s Fab 16 May Support 450mm Tools
Monday, December 13, 2010
TSMC Intends to Build a $10 Billion Fab 16 Production Facility.
TSMC Rumoured to Plan Another Gigafab in 2014
Thursday, December 9, 2010
Intel Confirms 450mm Nature of New Production Facility.
Intel D1X Fab Is "Compatible" with 450mm Production Equipment
Monday, October 25, 2010
Intel's D1X Fab to Be Ready for 450mm Wafers - Report.
Intel's Next-Gen Development Fab Will Be Able to Use 450mm Wafers
Thursday, May 6, 2010
TSMC Expects 450mm Production to Start in the “Middle of the Decade”.
TSMC Delays Pilot Production of 450mm Wafers by Years
Tuesday, October 6, 2009
TSMC Plans to Initiate Tests of 450mm Equipment in 2010 – Rumours.
Despite Economic Slump TSMC Still Interested in 450mm Wafers
Tuesday, July 14, 2009
Globalfoundries Claims 300mm Fabs Are Enough for Modern Chips.
Globalfoundries: Lean Manufacturing Is Most Efficient