Hardware news tagged NEC
Wednesday, February 17, 2010
NEC Develops 2GB/s High-Speed Serial Communication Interface.
NEC’s New Technology Outshines PCI Express 2.0, USB 3.0
Monday, December 21, 2009
Western Digital Teams Up with NEC for USB 3.0 Hard Drives.
NEC and WD to Jointly Promote SuperSpeed USB
Tuesday, November 17, 2009
Intel Teams Up with NEC to Develop Supercomputing Technologies.
Intel and NEC Team Up for High-Performance Computing
Tuesday, September 8, 2009
Mainboard Makers See No Opportunity in Jointly-Designed Japanese Microprocessor.
Mainboard Makers Pessimistic About Japanese Jointly-Developed CPU
Monday, September 7, 2009
Seven Japanese Companies to Develop Microprocessor to Compete Against AMD and Intel.
Japanese Companies to Create Chip to Rival AMD, Intel
Monday, June 29, 2009
European Commission Promises Universal Chargers for Mobile Phones Starting from 2010.
Leading Producers of Mobile Phones Reaffirm Commitment for Universal Cell Phone Chargers
Thursday, June 18, 2009
NEC and Toshiba to Join IBM in 28nm Process Tech Development.
IBM to Help NEC and Toshiba with 28nm Fabrication Process
Monday, May 18, 2009
NEC Electronics Unveils World’s First USB 3.0 Controller.
NEC Makes USB 3.0 Reality with the Launch of Controller
Monday, April 27, 2009
NEC Electronics Set to Merge with Renesas Technology.
NEC and Renesas to Integrate Semiconductor Businesses
Tuesday, February 17, 2009
Further Consolidation of PC Market in EMEA Region Expected.
As NEC Exits EMEA PC Market, Other Vendors Get New Opportunities in the Region
Saturday, January 31, 2009
Toshiba and NEC May Form Semiconductor Joint Venture.
Toshiba and NEC Looking Forward to Merge Chips Businesses
Tuesday, January 6, 2009
NEC’s New Memory Tech Can Enable Zero Power Consumption of Chips in Idle Mode.
NEC Demos Another Non-Volatile Memory Technology
Wednesday, December 17, 2008
Toshiba Touts “Cost Effective” 32nm Process Technology.
Toshiba Discloses Details about 32nm Fabrication Process