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Hardware news tagged Semiconductor
Monday, December 10, 2012
Intel: Transition to 450mm Will Terminate Half of Semiconductor Market Players.
Numerous Transitions Incoming This Decade Will Reduce the Number of Semiconductor Companies - Paul Otellini
Friday, December 7, 2012
Hitachi to Cease Chip Manufacturing by Early 2014.
Hitachi Pulls the Plug on Semiconductor Business
Thursday, December 6, 2012
Intel’s Chief Executive Hints Growing Importance of Foundry Business for Company.
Paul Otellini: There Are Numerous Foundry Projects in the Pipeline
AMD Amends Wafer Supply Agreement with Globalfoundries for Second Time in 2012
TSMC Ramps Up 28nm Capacity Ahead of Plans
Wednesday, December 5, 2012
Qualcomm Becomes World’s Fastest Growing Semiconductor Company.
Qualcomm Ranks World’s No. 3 Semiconductor Company
Tuesday, December 4, 2012
Globalfoundries to Start 14nm Tests in Q1 2013 - Company.
AMD Will Not Benefit from Globalfoundries Rapid Transition to 14nm
Thursday, November 29, 2012
TSMC Breaks Ground to Build 16nm FinFET Fab.
TSMC Begins to Build Fab 14 Phase 6 Fab, Reveals Plans for Phase 7 Factory
Wednesday, November 21, 2012
TSMC Rumoured to Build Semiconductor Manufacturing Facility in the U.S.
TSMC May Build Large Fab in the U.S. to Compete for Fabless Clients like Apple
Tuesday, November 20, 2012
UMC Gets New Chief Exec After Restructuring of Management Team.
UMC Replaces Chief Executive Officer with 300mm Production Specialist
Tuesday, November 13, 2012
Toshiba Temporarily Reopens Semiconductor Facility in Thailand.
Toshiba Reopens Chip Plant After Last Year’s Flooding
Friday, November 2, 2012
UMC to Develop 14nm FinFET Process Tech with 20nm Back-End.
UMC Follows Globalfoundries with Hybrid 14nm FinFET
Thursday, November 1, 2012
Globalfoundries Delays Abu Dhabi Fab to Concentrate on Profitability - Report.
Globalfoundries Aims to Become Profitable by 2015, But Freezes Investment into Abu Dhabi Plant
Monday, October 29, 2012
IBM Opens Up the Path for Commercial Fabrication of Carbon Nanotubes.
IBM Gets One Step Closer to New Types of Semiconductors
Thursday, October 25, 2012
TSMC: 450mm Fabs and EUV Lithography Critically Important for 10nm, 7nm Nodes.
TSMC to Build Center to Research and Develop 7nm Process Technology, 450mm Manufacturing
28nm Production Now Accounts for 13% of TSMC Revenue
Monday, October 22, 2012
TSMC Lays Process Technology Roadmap Out.
TSMC’s Roadmap Points to 16nm in 2014, 10nm in 2016
Wednesday, October 17, 2012
ASML and Cymer Provide Status Update Regarding Development of EUV Lithography Tools.
ASML Continues to Expect Commercial EUV Tools in 2014
ASML to Buy Lithography Light Source Maker
Tuesday, October 9, 2012
TSMC Unveils 20nm and CoWoS Reference Flows for Chip Developers.
TSMC's New Reference Flows Enable Double Patterning, Multi-Die Integration
Tuesday, October 2, 2012
IBM and Globalfoundries to Use High-Productivity Combinatorial Tech for Development of Next-Gen Nodes.
IBM and Globalfoundries Team Up with Intermolecular for Next-Gen Nodes
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