Hardware news tagged Semiconductor
Monday, April 22, 2013
ARM: 14nm FinFET Technology Will Enable Higher-Performance and Lower Power Consumption, But There Are Challenges.
Tight Collaboration Will Be Needed to Take Full Advantage of 14nm FinFET and More Advanced Technologies – ARM
Friday, April 19, 2013
ASML On Track to Deliver 450mm Production Equipment in 2015.
ASML Sees Start of 450mm Production in 2018
Wednesday, April 17, 2013
ASML: EUV Tools Are Making Progress, But Chip Manufacturing Will Slip to 2015.
ASML Receives Additional Orders for EUV Equipment
Tuesday, April 16, 2013
Intel: Foundry Business Will Not Have Substantial Revenue Impact for Two to Three Years.
Intel Is Collecting Serious Customers for Its Custom Foundry Division
Monday, April 15, 2013
TSMC: We Have Not Made a Decision to Build a Fab in the U.S.
TSMC Remains Cautious About Building a Fab in the U.S.
Friday, April 12, 2013
TSMC Pulls 16nm FinFET Risk Production to 2013.
TSMC to Offer Strong Alternative for Competitors
Thursday, April 11, 2013
Researchers Develop One-Layer Thick Germanium Sheet: May Replace Silicon in Semiconductors.
Germanane Set to Compete Against Graphene in the Future Chips
Apple Reportedly Works with TSMC on New Application Processor
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans
Wednesday, April 3, 2013
The End of Moore’s Law Is on Horizon – AMD.
AMD Reiterates Slow Transition to 20nm Node
Intel Reportedly Lands Chip Orders from Cisco
Tuesday, April 2, 2013
GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology.
GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process
TSMC Produces World’s First ARM Cortex-A57 64-Bit Chip Using 16nm FinFET Technology
Wednesday, March 27, 2013
TSMC Evacuates Personnel from Fabs as Earthquake Shakes Taiwan.
Quake Shakes TSMC Facilities, Causes Evacuation, Fate of Wafers Unclear
Monday, March 25, 2013
IBM Scientists Discover New Atomic Technique to Charge Memory Chips.
IBM Discovers New Method for Charging Memory Chips
Tuesday, March 19, 2013
GlobalFoundries Partners with ASML for Leading-edge Chip Tapeouts.
ASML’s Division and GlobalFoundries Team Up to Improve 14nm, 20nm and 28nm Yields
Thursday, March 14, 2013
Intel Leads Unexpectedly Large Decline in Semiconductor Market Inventory – Researchers.
Semiconductor Companies Reduce Inventory Levels by $1 Billion in One Quarter
Monday, March 11, 2013
Intel Considers Sanjay Jha, Patrick Gelsinger onto CEO Role.
Intel Actively Searching for CEO Outside of the Company
Thursday, March 7, 2013
Apple and Intel Have Discussed Foundry Deal – Media Report.
New Chief Executive of Intel May Be More Active Regarding Foundry Business
Wednesday, March 6, 2013
Financial Analyst: EUV May Be Late Again and See Limited Usage.
ASML May Further Suffer From EUV Lithography Delays